Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8531009 | Package structure of three-dimensional stacking dice and method for manufacturing the same | Chun-Te Lin, Shu-Ming Chang | 2013-09-10 |
| 8193632 | Three-dimensional conducting structure and method of fabricating the same | Hsiang-Hung Chang, Shu-Ming Chang, Yuan-Chang Lee | 2012-06-05 |
| 7663231 | Image sensor module with a three-dimensional die-stacking structure | Shu-Ming Chang, Chia-Wen Chiang, Hsiang-Hung Chang | 2010-02-16 |