Issued Patents All Time
Showing 26–50 of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9548265 | Chip package and manufacturing method thereof | Yen-Shih Ho, Hsing-Lung SHEN, Yu-Hao SU, Kuan-Jung Wu, Yi-Hua Cheng | 2017-01-17 |
| 9437478 | Chip package and method for forming the same | Yen-Shih Ho, Tsang-Yu Liu, Yu-Lung Huang, Chao-Yen Lin, Wei-Luen SUEN +2 more | 2016-09-06 |
| 9425134 | Chip package | Yen-Shih Ho, Tsang-Yu Liu, Yu-Lung Huang, Chao-Yen Lin, Wei-Luen SUEN +1 more | 2016-08-23 |
| 9419050 | Manufacturing method of semiconductor structure with protein tape | Yen-Shih Ho, Yung-Tai Tsai, Tsang-Yu Liu | 2016-08-16 |
| 9406818 | Chip package and method of manufacturing the same | Tsang-Yu Liu, Po-Han Lee | 2016-08-02 |
| 9373597 | Chip package and method thereof | Yen-Shih Ho, Chia-Ming Cheng | 2016-06-21 |
| 9355975 | Chip package and method for forming the same | Yen-Shih Ho, Tsang-Yu Liu, Yu-Lung Huang, Chao-Yen Lin, Wei-Luen SUEN +2 more | 2016-05-31 |
| 9334158 | Chip package and method for forming the same | Yu-Ting Huang, Yen-Shih Ho, Tsang-Yu Liu | 2016-05-10 |
| 9331024 | IC wafer having electromagnetic shielding effects and method for making the same | Yao-Hsiang Chen, Tsang-Yu Liu, Yen-Shih Ho | 2016-05-03 |
| 9305843 | Chip package and method for forming the same | Bing-Siang Chen, Chien-Hui Chen, Tsang-Yu Liu, Yen-Shih Ho | 2016-04-05 |
| 9287417 | Semiconductor chip package and method for manufacturing thereof | Wei-Luen SUEN, Yu-Lung Huang, Yen-Shih Ho, Tsang-Yu Liu | 2016-03-15 |
| 9275963 | Semiconductor structure having stage difference surface and manufacturing method thereof | Yung-Tai Tsai, Chun-Wei Chang, Chien-Hui Chen, Tsang-Yu Liu, Yen-Shih Ho | 2016-03-01 |
| 9275958 | Chip package and method for forming the same | Yi-Min Lin, Yi-Ming Chang, Yen-Shih Ho, Tsang-Yu Liu, Chia-Ming Cheng | 2016-03-01 |
| 9269837 | Chip package and method of manufacturing the same | Tsang-Yu Liu, Po-Han Lee | 2016-02-23 |
| 9268443 | Capacitive touch panel with electrode pairs | Shu-Wen Chang | 2016-02-23 |
| 9093450 | Chip package and manufacturing method thereof | Baw-Ching Perng, Ying-Nan Wen | 2015-07-28 |
| 9054114 | Chip package structure and manufacturing method thereof | Hung-Jen Lee, Chen-Han Chiang, Tsang-Yu Liu, Yen-Shih Ho | 2015-06-09 |
| 9006896 | Chip package and method for forming the same | Yu-Lung Huang, Tsang-Yu Liu | 2015-04-14 |
| 8963312 | Stacked chip package and method for forming the same | Yen-Shih Ho, Tsang-Yu Liu, Yu-Lung Huang, Chao-Yen Lin, Wei-Luen SUEN +1 more | 2015-02-24 |
| 8928098 | Semiconductor package and fabrication method thereof | Hung-Jen Lee, Tsang-Yu Liu, Yen-Shih Ho | 2015-01-06 |
| 8900924 | Chip package and method for forming the same | Tsang-Yu Liu, Yen-Shih Ho | 2014-12-02 |
| 8860217 | Electronic device package | Wei-Ming Chen | 2014-10-14 |
| 8778798 | Electronic device package and fabrication method thereof | Bai-Yao Lou, Ying-Nan Wen, Chien-Hung Liu | 2014-07-15 |
| 8779558 | Chip package structure and manufacturing method thereof | Hung-Jen Lee, Chen-Han Chiang, Tsang-Yu Liu, Yen-Shih Ho | 2014-07-15 |
| 8772932 | Electronic device package | Wei-Ming Chen | 2014-07-08 |