YH

Ying-Po Hung

UT Unimicron Technology: 1 patents #166 of 284Top 60%
WN Wistron Neweb: 1 patents #298 of 577Top 55%
Overall (All Time): #1,852,748 of 4,157,543Top 45%
2
Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
11410901 Package structure and manufacturing method thereof Lee-Cheng Shen, CHAO-CHIEH CHAN, CHAO-HSUAN WANG 2022-08-09
9935046 Package device and manufacturing method thereof 2018-04-03