Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11869850 | Package structure comprising conductive metal board and ground element | Lee-Cheng Shen, Po-Sheng Huang | 2024-01-09 |
| 11410901 | Package structure and manufacturing method thereof | Lee-Cheng Shen, Ying-Po Hung, CHAO-CHIEH CHAN | 2022-08-09 |