Issued Patents All Time
Showing 26–33 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6024274 | Method for tape automated bonding to composite bumps | Shyuan-Jeng Ho, Yu-Chi Lee, Jen-Huang Jeng, Pao-Yun Tang, Su-Yu Fang | 2000-02-15 |
| 5861661 | Composite bump tape automated bonded structure | Pao-Yun Tang, Yu-Chi Lee, Su-Yu Fang | 1999-01-19 |
| 5749997 | Composite bump tape automated bonding method and bonded structure | Pao-Yun Tang, Yu-Chi Lee, Su-Yu Fang | 1998-05-12 |
| 5707902 | Composite bump structure and methods of fabrication | Yu-Chi Lee, Jwo-Huei Jou | 1998-01-13 |
| 5578527 | Connection construction and method of manufacturing the same | Yu-Chi Lee, Pao-Yun Tang | 1996-11-26 |
| 5431328 | Composite bump flip chip bonding | Chih-Chiang Chu, Yu-Chi Lee | 1995-07-11 |
| 5393697 | Composite bump structure and methods of fabrication | Yu-Chi Lee, Hsiu-Mei Yu, Li-Hui Yang, Jwo-Huei Jou | 1995-02-28 |
| 5127573 | Tape automated bonding apparatus with automatic leveling stage | Jen-Huang Jeng | 1992-07-07 |