Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10825851 | Sensor package structure | LI-CHUN HUNG, Hsiu-Wen Tu, Jo-Wei Yang, CHIEN-CHEN LEE, Jian-Ru Chen | 2020-11-03 |
| 10361235 | Image sensor | Hsiang-Hung Chang | 2019-07-23 |
| 8736083 | Bonding inspection structure | Hsiao-Ting Lee, Chao-Chyun An | 2014-05-27 |
| 8215969 | Contact structure and forming method thereof and connecting structure thereof | Shyh-Ming Chang | 2012-07-10 |
| 8211788 | Method of fabricating bonding structure | Shyh-Ming Chang | 2012-07-03 |
| 8164187 | Flip chip device and manufacturing method thereof | Wen-Chih Chen | 2012-04-24 |
| 7977788 | Contact structure having a compliant bump and a testing area | Shyh-Ming Chang, Chao-Chyun An | 2011-07-12 |
| 7611548 | Vertical sublimation apparatus | Shyue-Ming Jang, Bang-I Liou, Jun Chen, Long-Shuenn Jean, Chun-Te Tsai +1 more | 2009-11-03 |
| 7576430 | Bonding structure | Shyh-Ming Chang | 2009-08-18 |
| 7449716 | Bond quality indication by bump structure on substrate | Ming-Yao Chen, Shyh-Ming Chang, Ngai Tsang | 2008-11-11 |
| 6972490 | Bonding structure with compliant bumps | Shyh-Ming Chang, Yuan-Chang Huang, Wen-Chih Chen | 2005-12-06 |