Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10825851 | Sensor package structure | Sheng-Shu Yang, LI-CHUN HUNG, Hsiu-Wen Tu, CHIEN-CHEN LEE, Jian-Ru Chen | 2020-11-03 |
| 10720370 | Sensor package structure | Jian-Ru Chen, Chung-Hsien Hsin, Hsiu-Wen Tu | 2020-07-21 |
| 10600830 | Sensor package structure | Jian-Ru Chen, LI-CHUN HUNG, Hsiu-Wen Tu, Chung-Hsien Hsin | 2020-03-24 |
| 10340250 | Stack type sensor package structure | Jian-Ru Chen, LI-CHUN HUNG, Hsiu-Wen Tu | 2019-07-02 |
| 9905597 | Sensor package structure | Chung-Hsien Hsin, Ming-Hui Chen | 2018-02-27 |
| 9184331 | Method for reducing tilt of optical unit during manufacture of image sensor | Chun-Hua Chuang, Chien-Wei Chang, Chen Peng, Chung-Hsien Hsin, Chun-Lung Huang +4 more | 2015-11-10 |
| 8969120 | Two-stage packaging method of image sensors | Chun-Lung Huang, Hsiu-Wen Tu, Cheng-Chang Wu, Chung-Yu Yang, Rong Wang | 2015-03-03 |
| 8703519 | Structure and manufacturing method for high resolution camera module | Chun-Lung Huang, Hsiu-Wen Tu, Cheng-Chang Wu, Chung-Yu Yang, Rong Wang | 2014-04-22 |