Chen Peng — 17 Patents at Kingpak Technology

Chen Peng has been granted 17 US patents while listed as an inventor at Kingpak Technology. The first was granted in 2002 and the most recent in August 2023. Chen Peng ranks #263,971 of 4,157,543 US inventors in our database (top 6.3%). Patent records list Chen Peng in Baoshan, TW.

Issued Patents All Time

Showing 1–17 of 17 patents

Patent #	Title	Co-Inventors	Date
11735562	Sensor package structure	CHIEN-CHEN LEE	2023-08-22
11133348	Sensor package structure and sensing module thereof	LI-CHUN HUNG, CHIEN-CHEN LEE, Jian-Ru Chen	2021-09-28
10868062	Sensor package structure	CHIEN-CHEN LEE, Chien LIN, Jian-Ru Chen	2020-12-15
10600829	Package base core and sensor package structure	Chung-Hsin Hsin, Chien LIN, KUN-CHIH HSIEH	2020-03-24
10411055	Sensor package structure	Chun-Hua Chuang, Wen-Chung Huang, Chung-Hsien Hsin, LI-CHUN HUNG	2019-09-10
9184331	Method for reducing tilt of optical unit during manufacture of image sensor	Chun-Hua Chuang, Chien-Wei Chang, Chung-Hsien Hsin, Chun-Lung Huang, Hsiu-Wen Tu +4 more	2015-11-10
8450137	Method for reducing tilt of transparent window during manufacturing of image sensor	Chun-Hua Chuang, Yao-Nien Chuang, Tiao-Mu Hsu, Chien-Wei Chang, Chien-Hen Lin +1 more	2013-05-28
8004602	Image sensor structure and integrated lens module thereof	Chung-Hsien Hsin, Chun-Hua Chuang, Chien-Wei Chang, Chien-Hen Lin	2011-08-23
7598580	Image sensor module package structure with supporting element	Chung-Hsien Hsin, Chun-Hua Chuang, Chien-Wei Chang, Chien-Hen Lin	2009-10-06
7554599	Image sensor module with air escape hole and a method for manufacturing the same	Hsiu-Wen Tu, Mon Ho, Jason Chuang, Chung-Hsien Hsin, Wei-Lin Chang	2009-06-30
7423334	Image sensor module with a protection layer and a method for manufacturing the same	Hsiu-Wen Tu, Mon Ho, Chung-Hsien Hsin	2008-09-09
7235869	Integrated circuit package having a resistant layer for stopping flowed glue	Pierre Liu	2007-06-26
6642137	Method for manufacturing a package structure of integrated circuits	Nai Hua Yeh, Jichen Wu	2003-11-04
6642554	Memory module structure	Nai Hua Yeh, Chief Lin, C. Cheng, Kuang-Yu Fan, Ren Long Kau +5 more	2003-11-04
6501187	Semiconductor package structure having central leads and method for packaging the same	Nai Hua Yeh, Chief Lin, Ching-Shui CHENG, Allis Chen	2002-12-31
6472736	Stacked structure for memory chips	Nai Hua Yeh	2002-10-29
6400007	Stacked structure of semiconductor means and method for manufacturing the same	Jichen Wu, Meng-Ru Tsai, Nai Hua Yeh	2002-06-04

Chen Peng — 17 Patents

Issued Patents All Time

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