CP

Chen Peng

KT Kingpak Technology: 15 patents #3 of 84Top 4%
TI Tong Hsing Electronic Industries: 1 patents #19 of 38Top 50%
Overall (All Time): #270,594 of 4,157,543Top 7%
17
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
11735562 Sensor package structure CHIEN-CHEN LEE 2023-08-22
11133348 Sensor package structure and sensing module thereof LI-CHUN HUNG, CHIEN-CHEN LEE, Jian-Ru Chen 2021-09-28
10868062 Sensor package structure CHIEN-CHEN LEE, Chien LIN, Jian-Ru Chen 2020-12-15
10600829 Package base core and sensor package structure Chung-Hsin Hsin, Chien LIN, KUN-CHIH HSIEH 2020-03-24
10411055 Sensor package structure Chun-Hua Chuang, Wen-Chung Huang, Chung-Hsien Hsin, LI-CHUN HUNG 2019-09-10
9184331 Method for reducing tilt of optical unit during manufacture of image sensor Chun-Hua Chuang, Chien-Wei Chang, Chung-Hsien Hsin, Chun-Lung Huang, Hsiu-Wen Tu +4 more 2015-11-10
8450137 Method for reducing tilt of transparent window during manufacturing of image sensor Chun-Hua Chuang, Yao-Nien Chuang, Tiao-Mu Hsu, Chien-Wei Chang, Chien-Hen Lin +1 more 2013-05-28
8004602 Image sensor structure and integrated lens module thereof Chung-Hsien Hsin, Chun-Hua Chuang, Chien-Wei Chang, Chien-Hen Lin 2011-08-23
7598580 Image sensor module package structure with supporting element Chung-Hsien Hsin, Chun-Hua Chuang, Chien-Wei Chang, Chien-Hen Lin 2009-10-06
7554599 Image sensor module with air escape hole and a method for manufacturing the same Hsiu-Wen Tu, Mon Ho, Jason Chuang, Chung-Hsien Hsin, Wei-Lin Chang 2009-06-30
7423334 Image sensor module with a protection layer and a method for manufacturing the same Hsiu-Wen Tu, Mon Ho, Chung-Hsien Hsin 2008-09-09
7235869 Integrated circuit package having a resistant layer for stopping flowed glue Pierre Liu 2007-06-26
6642137 Method for manufacturing a package structure of integrated circuits Nai Hua Yeh, Jichen Wu 2003-11-04
6642554 Memory module structure Nai Hua Yeh, Chief Lin, C. Cheng, Kuang-Yu Fan, Ren Long Kau +5 more 2003-11-04
6501187 Semiconductor package structure having central leads and method for packaging the same Nai Hua Yeh, Chief Lin, Ching-Shui CHENG, Allis Chen 2002-12-31
6472736 Stacked structure for memory chips Nai Hua Yeh 2002-10-29
6400007 Stacked structure of semiconductor means and method for manufacturing the same Jichen Wu, Meng-Ru Tsai, Nai Hua Yeh 2002-06-04