Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12048228 | Image capture device | Chung-Hao Tseng | 2024-07-23 |
| 11783621 | Optical fingerprint imaging device | Ping-Chen Chen, Chuan-Min LEE, Chung-Hao Tseng | 2023-10-10 |
| 8847146 | Image sensor package structure with casing including a vent without sealing and in communication with package material | Hsiu-Wen Tu, Ren-Long Kuo, Young-Houng Shiao, Tsao-Pin Chen, Chih-Cheng Hsu +2 more | 2014-09-30 |
| 8093674 | Manufacturing method for molding image sensor package structure and image sensor package structure thereof | Hsiu-Wen Tu, Ren-Long Kuo, Young-Houng Shiao, Tsao-Pin Chen, Chih-Cheng Hsu +2 more | 2012-01-10 |
| 7554599 | Image sensor module with air escape hole and a method for manufacturing the same | Hsiu-Wen Tu, Jason Chuang, Chen Peng, Chung-Hsien Hsin, Wei-Lin Chang | 2009-06-30 |
| 7423334 | Image sensor module with a protection layer and a method for manufacturing the same | Hsiu-Wen Tu, Chen Peng, Chung-Hsien Hsin | 2008-09-09 |
| 6737720 | Packaging structure of image sensor and method for packaging the same | Hsiu-Wen Tu, Ching-Shui CHENG, Li Huan Chen, Joe Liu, Jichen Wu +1 more | 2004-05-18 |
| 6627983 | Stacked package structure of image sensor | Hsiu-Wen Tu, Wen-Chuan Chen, Li Huan Chen, Nai Hua Yeh, Yen-Cheng Huang +4 more | 2003-09-30 |
| 6590269 | Package structure for a photosensitive chip | Jason Chuang, Allis Chen, Jachson Hsieh, Hsiu-Wen Tu, Meng-Ru Tsai +4 more | 2003-07-08 |
| 6565008 | Module card and a method for manufacturing the same | Hsiu-Wen Tu, Kuo Feng Feng, Yung-Sheng Chiu, Joe Liu, Nai Hua Yeh +2 more | 2003-05-20 |
| 6559539 | Stacked package structure of image sensor | Hsiu-Wen Tu, Wen-Chuan Chen, Li Huan Chen, Nai Hua Yeh, Yen-Cheng Huang +2 more | 2003-05-06 |
| 6521881 | Stacked structure of an image sensor and method for manufacturing the same | Hsiu-Wen Tu, Wen-Chuan Chen, Li Huan Chen, Jichen Wu, Meng-Ru Tsai | 2003-02-18 |
| 6489572 | Substrate structure for an integrated circuit package and method for manufacturing the same | Chih-Hong Chen, Yen-Cheng Huang, Li Huan Chen, Kuo-Feng Peng, Jichen Wu +2 more | 2002-12-03 |