MH

Mon Ho

KT Kingpak Technology: 8 patents #8 of 84Top 10%
GT Gingy Technology: 2 patents #13 of 33Top 40%
Overall (All Time): #369,684 of 4,157,543Top 9%
13
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12048228 Image capture device Chung-Hao Tseng 2024-07-23
11783621 Optical fingerprint imaging device Ping-Chen Chen, Chuan-Min LEE, Chung-Hao Tseng 2023-10-10
8847146 Image sensor package structure with casing including a vent without sealing and in communication with package material Hsiu-Wen Tu, Ren-Long Kuo, Young-Houng Shiao, Tsao-Pin Chen, Chih-Cheng Hsu +2 more 2014-09-30
8093674 Manufacturing method for molding image sensor package structure and image sensor package structure thereof Hsiu-Wen Tu, Ren-Long Kuo, Young-Houng Shiao, Tsao-Pin Chen, Chih-Cheng Hsu +2 more 2012-01-10
7554599 Image sensor module with air escape hole and a method for manufacturing the same Hsiu-Wen Tu, Jason Chuang, Chen Peng, Chung-Hsien Hsin, Wei-Lin Chang 2009-06-30
7423334 Image sensor module with a protection layer and a method for manufacturing the same Hsiu-Wen Tu, Chen Peng, Chung-Hsien Hsin 2008-09-09
6737720 Packaging structure of image sensor and method for packaging the same Hsiu-Wen Tu, Ching-Shui CHENG, Li Huan Chen, Joe Liu, Jichen Wu +1 more 2004-05-18
6627983 Stacked package structure of image sensor Hsiu-Wen Tu, Wen-Chuan Chen, Li Huan Chen, Nai Hua Yeh, Yen-Cheng Huang +4 more 2003-09-30
6590269 Package structure for a photosensitive chip Jason Chuang, Allis Chen, Jachson Hsieh, Hsiu-Wen Tu, Meng-Ru Tsai +4 more 2003-07-08
6565008 Module card and a method for manufacturing the same Hsiu-Wen Tu, Kuo Feng Feng, Yung-Sheng Chiu, Joe Liu, Nai Hua Yeh +2 more 2003-05-20
6559539 Stacked package structure of image sensor Hsiu-Wen Tu, Wen-Chuan Chen, Li Huan Chen, Nai Hua Yeh, Yen-Cheng Huang +2 more 2003-05-06
6521881 Stacked structure of an image sensor and method for manufacturing the same Hsiu-Wen Tu, Wen-Chuan Chen, Li Huan Chen, Jichen Wu, Meng-Ru Tsai 2003-02-18
6489572 Substrate structure for an integrated circuit package and method for manufacturing the same Chih-Hong Chen, Yen-Cheng Huang, Li Huan Chen, Kuo-Feng Peng, Jichen Wu +2 more 2002-12-03