Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6646316 | Package structure of an image sensor and packaging | Jichen Wu, Hsiu-Wen Tu, C. H. Chen, Wen-Chuan Chen | 2003-11-11 |
| 6489572 | Substrate structure for an integrated circuit package and method for manufacturing the same | Mon Ho, Chih-Hong Chen, Yen-Cheng Huang, Li Huan Chen, Jichen Wu +2 more | 2002-12-03 |
| 6441496 | Structure of stacked integrated circuits | Wen-Chuan Chen, Jichen Wu, Chia-Jung Chang | 2002-08-27 |