Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7345360 | Multiple chips image sensor package | Figo Hsieh | 2008-03-18 |
| 7250324 | Method for manufacturing an image sensor | Jackson Hsieh | 2007-07-31 |
| 7126219 | Small memory card | Jackson Hsieh, Worrell Tsai, Bruce Chen | 2006-10-24 |
| 6910637 | Stacked small memory card | Jackson Hsieh, Abnet Chen | 2005-06-28 |
| 6906397 | Image sensor having an improved transparent layer | Jackson Hsieh, Channing Wel, Bird Lin | 2005-06-14 |
| 6878917 | Injection molded image sensor and a method for manufacturing the same | Jackson Hsieh, Bruce Chen, Worrell Tsai | 2005-04-12 |
| 6870208 | Image sensor module | Irving You, Hsiu-Wen Tu, Jason Chang, Figo Hsieh | 2005-03-22 |
| 6747261 | Image sensor having shortened wires | Jackson Hsieh, Bruce Chen, Jack Chuang | 2004-06-08 |
| 6737720 | Packaging structure of image sensor and method for packaging the same | Mon Ho, Hsiu-Wen Tu, Ching-Shui CHENG, Li Huan Chen, Joe Liu +1 more | 2004-05-18 |
| 6680525 | Stacked structure of an image sensor | Jackson Hsieh, Bruce Chen | 2004-01-20 |
| 6649834 | Injection molded image sensor and a method for manufacturing the same | Jackson Hsieh, Bruce Chen, Kevin Chang | 2003-11-18 |
| 6646316 | Package structure of an image sensor and packaging | Hsiu-Wen Tu, Kuo-Feng Peng, C. H. Chen, Wen-Chuan Chen | 2003-11-11 |
| 6642137 | Method for manufacturing a package structure of integrated circuits | Nai Hua Yeh, Chen Peng | 2003-11-04 |
| 6638097 | Probe structure | Burton B. Yang | 2003-10-28 |
| 6627983 | Stacked package structure of image sensor | Hsiu-Wen Tu, Wen-Chuan Chen, Mon Ho, Li Huan Chen, Nai Hua Yeh +4 more | 2003-09-30 |
| 6590269 | Package structure for a photosensitive chip | Jason Chuang, Allis Chen, Jachson Hsieh, Hsiu-Wen Tu, Meng-Ru Tsai +4 more | 2003-07-08 |
| 6559539 | Stacked package structure of image sensor | Hsiu-Wen Tu, Wen-Chuan Chen, Mon Ho, Li Huan Chen, Nai Hua Yeh +2 more | 2003-05-06 |
| 6521881 | Stacked structure of an image sensor and method for manufacturing the same | Hsiu-Wen Tu, Wen-Chuan Chen, Mon Ho, Li Huan Chen, Meng-Ru Tsai | 2003-02-18 |
| 6489572 | Substrate structure for an integrated circuit package and method for manufacturing the same | Mon Ho, Chih-Hong Chen, Yen-Cheng Huang, Li Huan Chen, Kuo-Feng Peng +2 more | 2002-12-03 |
| 6441496 | Structure of stacked integrated circuits | Wen-Chuan Chen, Kuo-Feng Peng, Chia-Jung Chang | 2002-08-27 |
| 6400007 | Stacked structure of semiconductor means and method for manufacturing the same | Meng-Ru Tsai, Nai Hua Yeh, Chen Peng | 2002-06-04 |