Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6642554 | Memory module structure | Chen Peng, Chief Lin, C. Cheng, Kuang-Yu Fan, Ren Long Kau +5 more | 2003-11-04 |
| 6642137 | Method for manufacturing a package structure of integrated circuits | Chen Peng, Jichen Wu | 2003-11-04 |
| 6627983 | Stacked package structure of image sensor | Hsiu-Wen Tu, Wen-Chuan Chen, Mon Ho, Li Huan Chen, Yen-Cheng Huang +4 more | 2003-09-30 |
| 6565008 | Module card and a method for manufacturing the same | Mon Ho, Hsiu-Wen Tu, Kuo Feng Feng, Yung-Sheng Chiu, Joe Liu +2 more | 2003-05-20 |
| 6559539 | Stacked package structure of image sensor | Hsiu-Wen Tu, Wen-Chuan Chen, Mon Ho, Li Huan Chen, Yen-Cheng Huang +2 more | 2003-05-06 |
| 6501187 | Semiconductor package structure having central leads and method for packaging the same | Chen Peng, Chief Lin, Ching-Shui CHENG, Allis Chen | 2002-12-31 |
| 6472736 | Stacked structure for memory chips | Chen Peng | 2002-10-29 |
| 6400007 | Stacked structure of semiconductor means and method for manufacturing the same | Jichen Wu, Meng-Ru Tsai, Chen Peng | 2002-06-04 |