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Image sensor package structure with casing including a vent without sealing and in communication with package material |
Hsiu-Wen Tu, Ren-Long Kuo, Young-Houng Shiao, Mon Ho, Chih-Cheng Hsu +2 more |
2014-09-30 |
| 8828777 |
Wafer level image sensor packaging structure and manufacturing method of the same |
Hsiu-Wen Tu, Chung-Hsien Hsin, Han-Hsing Chen, Ming-Hui Chen, Ren-Long Kuo +2 more |
2014-09-09 |
| 8390087 |
Image sensor package structure with large air cavity |
Hsiu-Wen Tu, Ren-Long Kuo, Young-Houng Shiao, Mon-Nam Ho, Chih-Cheng Hsu +2 more |
2013-03-05 |
| 8378441 |
Manufacturing method and structure of a wafer level image sensor module with package structure |
Hsiu-Wen Tu, Chung-Hsien Hsin, Han-Hsing Chen, Ming-Hui Chen, Ren-Long Kuo +2 more |
2013-02-19 |
| 8093674 |
Manufacturing method for molding image sensor package structure and image sensor package structure thereof |
Hsiu-Wen Tu, Ren-Long Kuo, Young-Houng Shiao, Mon Ho, Chih-Cheng Hsu +2 more |
2012-01-10 |