| 8928104 |
Image sensor packaging structure with black encapsulant |
Hsiu-Wen Tu, Chung-Hsien Hsin, Chun-Hua Chuang, Chin-Fu Lin, Young-Houng Shiao |
2015-01-06 |
| 8847146 |
Image sensor package structure with casing including a vent without sealing and in communication with package material |
Hsiu-Wen Tu, Young-Houng Shiao, Tsao-Pin Chen, Mon Ho, Chih-Cheng Hsu +2 more |
2014-09-30 |
| 8828777 |
Wafer level image sensor packaging structure and manufacturing method of the same |
Hsiu-Wen Tu, Chung-Hsien Hsin, Han-Hsing Chen, Ming-Hui Chen, Chih-Cheng Hsu +2 more |
2014-09-09 |
| 8481343 |
Manufacturing method of molded image sensor packaging structure with predetermined focal length and the structure using the same |
Chung-Hsien Hsin, Hsiu-Wen Tu, Chun-Hua Chuang, Chin-Fu Lin, Young-Houng Shiao |
2013-07-09 |
| 8441086 |
Image sensor packaging structure with predetermined focal length |
Hsiu-Wen Tu, Chung-Hsien Hsin, Chun-Hua Chuang, Chin-Fu Lin, Young-Houng Shiao |
2013-05-14 |
| 8390087 |
Image sensor package structure with large air cavity |
Hsiu-Wen Tu, Young-Houng Shiao, Tsao-Pin Chen, Mon-Nam Ho, Chih-Cheng Hsu +2 more |
2013-03-05 |
| 8378441 |
Manufacturing method and structure of a wafer level image sensor module with package structure |
Hsiu-Wen Tu, Chung-Hsien Hsin, Han-Hsing Chen, Ming-Hui Chen, Chih-Cheng Hsu +2 more |
2013-02-19 |
| 8093674 |
Manufacturing method for molding image sensor package structure and image sensor package structure thereof |
Hsiu-Wen Tu, Young-Houng Shiao, Tsao-Pin Chen, Mon Ho, Chih-Cheng Hsu +2 more |
2012-01-10 |
| 6632037 |
Keyboard assembly with positioning function |
Winky Lin, Ken-Ching Chen |
2003-10-14 |