Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8928104 | Image sensor packaging structure with black encapsulant | Hsiu-Wen Tu, Chung-Hsien Hsin, Chun-Hua Chuang, Ren-Long Kuo, Chin-Fu Lin | 2015-01-06 |
| 8847146 | Image sensor package structure with casing including a vent without sealing and in communication with package material | Hsiu-Wen Tu, Ren-Long Kuo, Tsao-Pin Chen, Mon Ho, Chih-Cheng Hsu +2 more | 2014-09-30 |
| 8828777 | Wafer level image sensor packaging structure and manufacturing method of the same | Hsiu-Wen Tu, Chung-Hsien Hsin, Han-Hsing Chen, Ming-Hui Chen, Ren-Long Kuo +2 more | 2014-09-09 |
| 8481343 | Manufacturing method of molded image sensor packaging structure with predetermined focal length and the structure using the same | Chung-Hsien Hsin, Hsiu-Wen Tu, Chun-Hua Chuang, Ren-Long Kuo, Chin-Fu Lin | 2013-07-09 |
| 8441086 | Image sensor packaging structure with predetermined focal length | Hsiu-Wen Tu, Chung-Hsien Hsin, Chun-Hua Chuang, Ren-Long Kuo, Chin-Fu Lin | 2013-05-14 |
| 8390087 | Image sensor package structure with large air cavity | Hsiu-Wen Tu, Ren-Long Kuo, Tsao-Pin Chen, Mon-Nam Ho, Chih-Cheng Hsu +2 more | 2013-03-05 |
| 8378441 | Manufacturing method and structure of a wafer level image sensor module with package structure | Hsiu-Wen Tu, Chung-Hsien Hsin, Han-Hsing Chen, Ming-Hui Chen, Ren-Long Kuo +2 more | 2013-02-19 |
| 8093674 | Manufacturing method for molding image sensor package structure and image sensor package structure thereof | Hsiu-Wen Tu, Ren-Long Kuo, Tsao-Pin Chen, Mon Ho, Chih-Cheng Hsu +2 more | 2012-01-10 |