Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Manufacturing method for molding image sensor package structure and image sensor package structure thereof

Manufacturing method for molding image sensor package structure and image sensor package structure thereof

US Patent 8093674 · Granted Jan 10, 2012

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Optical imaging lens, imaging device, and electronic device2024
Image capture device2024
Magnetic tunnel junction (MTJ) device and forming method thereof2024
Optical fingerprint imaging device2023
Magnetic tunnel junction (MTJ) device and forming method thereof2023
Semiconductor device2022
Actuating mechanism and electronic device2022
Semiconductor structure with an epitaxial layer2022
ReRAM structure and method of fabricating the same2022
Sensor package structure2022
Electronic device base2022
Battery cell with increased tab area and method and apparatus for manufacturing 2021