Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12027470 | Package carrier having a stiffener between solder bumps | Yu-Min Lin, Chao-Jung Chen, Ren-Shin Cheng, Ang-Ying Lin, Po-Chih Chang | 2024-07-02 |
| 9941226 | Integrated millimeter-wave chip package | Cheng-Hua Tsai, Shyh-Jong Chung | 2018-04-10 |