Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12156325 | Package carrier with improved heat dissipation efficiency and manufacturing method thereof | Ming-Hao Wu, Hsuan-Wei Chen | 2024-11-26 |
| 11641720 | Circuit board and manufacturing method thereof | Pei-Wei Wang, Shao-Chien Lee, Ra-Min Tain, Po-Hsiang Wang, Pei-Chang Huang +1 more | 2023-05-02 |
| 11631626 | Package structure | Ra-Min Tain, Po-Hsiang Wang | 2023-04-18 |
| 11337303 | Circuit board structure | Ra-Min Tain, Po-Hsiang Wang | 2022-05-17 |
| 10881006 | Package carrier and package structure | Ra-Min Tain, Pei-Chang Huang, Chun-Lin Liao, Po-Hsiang Wang, Hsuan-Wei Chen | 2020-12-29 |