Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10813231 | Method for manufacturing circuit board | Po-Hsuan Liao | 2020-10-20 |
| 10497847 | Structure and manufacturing method of heat dissipation substrate and package structure and method thereof | Shao-Chien Lee, Chen W. Tseng, Zong-Hua Li | 2019-12-03 |
| 10477701 | Circuit board and method for manufacturing the same | Po-Hsuan Liao | 2019-11-12 |
| 10356901 | Manufacturing method of circuit board structure | Ming-Hao Wu | 2019-07-16 |
| 10159151 | Chip package circuit board module | Shao-Chien Lee, Chen W. Tseng, Zong-Hua Li, Chien-Tsai Li | 2018-12-18 |
| 10056356 | Chip package circuit board module | Shao-Chien Lee, Chen W. Tseng, Zong-Hua Li | 2018-08-21 |
| 10039184 | Circuit board structure and manufacturing method thereof | Ming-Hao Wu | 2018-07-31 |
| 8979372 | Circuit board and manufacturing method thereof and electro-optic apparatus having the circuit board | Pei-Chang Huang, Cheng-Po Yu | 2015-03-17 |
| 8598463 | Circuit board and manufacturing method thereof | Tzyy-Jang Tseng, Chang-Ming Lee, Cheng-Po Yu | 2013-12-03 |
| 8318411 | Method for fabricating an interposer | Chang-Ming Lee, Shih-Jung Huang, Ling-Kai Su | 2012-11-27 |
| 8294042 | Connector and manufacturing method thereof | Chang-Ming Lee, Shih-Jung Huang, Ling-Kai Su | 2012-10-23 |
| 8288662 | Circuit structure | Tzyy-Jang Tseng, Chang-Ming Lee, Cheng-Po Yu | 2012-10-16 |
| 8274798 | Carrier substrate and method for making the same | Shih-Jung Huang, Ling-Kai Su | 2012-09-25 |
| 8247705 | Circuit substrate and manufacturing method thereof | Tzyy-Jang Tseng, Chang-Ming Lee, Cheng-Po Yu | 2012-08-21 |
| 8161638 | Manufacturing method of circuit structure | Tzyy-Jang Tseng, Chang-Ming Lee, Cheng-Po Yu | 2012-04-24 |