Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11013103 | Method for forming circuit board stacked structure | Ra-Min Tain, Kai-Ming Yang | 2021-05-18 |
| 10178755 | Circuit board stacked structure and method for forming the same | Ra-Min Tain, Kai-Ming Yang | 2019-01-08 |
| 10159151 | Chip package circuit board module | Wen-Fang Liu, Shao-Chien Lee, Chen W. Tseng, Zong-Hua Li | 2018-12-18 |
| 10070536 | Manufacturing method of circuit board structure | Chien-Te Wu, Cheng-Chung Lo | 2018-09-04 |
| 9917046 | Manufacturing method of a circuit board having a glass film | Chien-Te Wu, Cheng-Chung Lo | 2018-03-13 |