Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11600936 | Circuit board structure | Tzyy-Jang Tseng, Pei-Wei Wang, Ching-Ho Hsieh, Shao-Chien Lee | 2023-03-07 |
| 11114782 | Method of manufacturing circuit board structure | Tzyy-Jang Tseng, Pei-Wei Wang, Ching-Ho Hsieh, Shao-Chien Lee | 2021-09-07 |
| 9499664 | Polyimide polymer, polyimide film having the same and polyimide laminate having the same | Der-Jen Sun, Chi-Sheng Chen, Yen-Huey Hsu | 2016-11-22 |
| 9234085 | Polyimide film and polyimide laminate thereof | Der-Jen Sun, Yen-Huey Hsu | 2016-01-12 |
| 7816169 | Colors only process to reduce package yield loss | Yang-Tung Fan, Chiou-Shian Peng, Cheng-Yu Chu, Shih-Jane Lin, Yen-Ming Chen +1 more | 2010-10-19 |