Issued Patents All Time
Showing 76–99 of 99 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8578600 | Process for manufacturing a circuit board | Shu-Sheng Chiang, Tsung-Yuan Chen | 2013-11-12 |
| 8563363 | Fabricating method of semiconductor package structure | Chin-Sheng Wang, Chih-Hong Chuang | 2013-10-22 |
| 8513796 | Package structure, fabricating method thereof, and package-on-package device thereby | Dyi-Chung Hu, Yu-Shan Hu | 2013-08-20 |
| 8450623 | Circuit board | Shu-Sheng Chiang, Tsung-Yuan Chen | 2013-05-28 |
| 8424202 | Process for fabricating a circuit board | Shu-Sheng Chiang, Tsung-Yuan Chen | 2013-04-23 |
| 8390013 | Semiconductor package structure and fabricating method of semiconductor package structure | Chin-Sheng Wang, Chih-Hong Chuang | 2013-03-05 |
| 8365401 | Circuit board and manufacturing method thereof | Shu-Sheng Chiang, Tsung-Yuan Chen | 2013-02-05 |
| 8294034 | Circuit board and process for fabricating the same | Shu-Sheng Chiang, Tsung-Yuan Chen | 2012-10-23 |
| 8288662 | Circuit structure | Chang-Ming Lee, Wen-Fang Liu, Cheng-Po Yu | 2012-10-16 |
| 8269337 | Packaging substrate having through-holed interposer embedded therein and fabrication method thereof | Yu-Shan Hu, Dyi-Chung Hu | 2012-09-18 |
| 8247705 | Circuit substrate and manufacturing method thereof | Chang-Ming Lee, Wen-Fang Liu, Cheng-Po Yu | 2012-08-21 |
| 8161638 | Manufacturing method of circuit structure | Chang-Ming Lee, Wen-Fang Liu, Cheng-Po Yu | 2012-04-24 |
| 8051560 | Method of fabricating a solder pad structure | Shu-Sheng Chiang | 2011-11-08 |
| 7906200 | Composite circuit substrate structure | Chih-Peng Fan | 2011-03-15 |
| 7867908 | Method of fabricating substrate | Chih-Ming Chang, Cheng-Po Yu, Chung W. Ho | 2011-01-11 |
| 7834274 | Multi-layer printed circuit board and method for fabricating the same | Ming-Huan Yang, Chung-Wei Wang, Chia-Chi Wu, Chao-Kai Cheng, Chang-Ming Lee +2 more | 2010-11-16 |
| 7642571 | Substrate core | Chih-Ming Chang, Cheng-Po Yu, Chung W. Ho | 2010-01-05 |
| 7535098 | Structure of substrate | Chih-Ming Chang, Cheng-Po Yu, Chung W. Ho | 2009-05-19 |
| 7520755 | Method of forming solder mask and wiring board with solder mask | Cheng-Po Yu | 2009-04-21 |
| 7393720 | Method for fabricating electrical interconnect structure | Shao-Chien Lee, Chang-Ming Lee | 2008-07-01 |
| 7080924 | LED light source with reflecting side wall | Bily Wang, Alen Ke | 2006-07-25 |
| 6201300 | Printed circuit board with thermal conductive structure | David C. H. Cheng, Shaw-Wen Lao | 2001-03-13 |
| 6057601 | Heat spreader with a placement recess and bottom saw-teeth for connection to ground planes on a thin two-sided single-core BGA substrate | John Hon-Shing Lau, Chen-Hua Cheng | 2000-05-02 |
| 6032355 | Method of forming thermal conductive structure on printed circuit board | David C. H. Cheng | 2000-03-07 |