Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10123413 | Package substrate and manufacturing method thereof | Chien-Hung Wu | 2018-11-06 |
| 9693468 | Package substrate and manufacturing method thereof | Chien-Hung Wu | 2017-06-27 |
| 9603263 | Manufacturing method of circuit substrate | Tzu-Wei Huang | 2017-03-21 |
| 8563363 | Fabricating method of semiconductor package structure | Tzyy-Jang Tseng, Chin-Sheng Wang | 2013-10-22 |
| 8510936 | Manufacturing method of package carrier | Tzu-Wei Huang | 2013-08-20 |
| 8390013 | Semiconductor package structure and fabricating method of semiconductor package structure | Tzyy-Jang Tseng, Chin-Sheng Wang | 2013-03-05 |