Issued Patents All Time
Showing 1–25 of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9237643 | Circuit board structure | Tsung-Yuan Chen, Shu-Sheng Chiang | 2016-01-12 |
| 8365400 | Manufacturing process for a circuit board | Tsung-Yuan Chen, Shu-Sheng Chiang | 2013-02-05 |
| 8288663 | Electrical interconnect structure and process thereof and circuit board structure | Tsung-Yuan Chen, Shu-Sheng Chiang | 2012-10-16 |
| 8153472 | Embedded chip package process | — | 2012-04-10 |
| 7888174 | Embedded chip package process | — | 2011-02-15 |
| 7772703 | Package substrate | — | 2010-08-10 |
| 7663249 | Embedded chip package structure | — | 2010-02-16 |
| 7284323 | Process of fabricating conductive column | — | 2007-10-23 |
| 6963548 | Coherent synchronization of code division multiple access signals | Donald C. D. Chang, Kar W. Yung, Frank A. Hagen, Ming U. Chang, John I. Novak, III | 2005-11-08 |
| 6807397 | Method for identifying growth limits of handheld services for mobile satellite communications | Donald C. D. Chang, Kar W. Yung, Urban A. Von Der Embse, John I. Novak, III, Frank Taormina +1 more | 2004-10-19 |
| 6785553 | Position location of multiple transponding platforms and users using two-way ranging as a calibration reference for GPS | Donald C. D. Chang, Kar W. Yung, Ming U. Chang, Frank A. Hagen | 2004-08-31 |
| 6766987 | Satellite system and method of deploying same | Frank Taormina, Donald C. D. Chang, Kar W. Yung, William W. Mayfield, John I. Novak, III +1 more | 2004-07-27 |
| 6709897 | Method of forming IC package having upward-facing chip cavity | Jao-Chin Cheng, Chih-Peng Fan | 2004-03-23 |
| 6643268 | Method for re-routing signals in a switch network | Kar W. Yung, Thu-Tam Trinh-Perches, Kenneth N. Gibson | 2003-11-04 |
| 6638858 | Hole metal-filling method | — | 2003-10-28 |
| 6606307 | Techniques for utilization of bandwidth space assets | Donald C. D. Chang, Kar W. Yung, Urban A. Von Der Embse, John I. Novak, III, Frank Taormina +1 more | 2003-08-12 |
| 6506632 | Method of forming IC package having downward-facing chip cavity | Jao-Chin Cheng, Chih-Peng Fan | 2003-01-14 |
| 6506633 | Method of fabricating a multi-chip module package | Jao-Chin Cheng, Chih-Peng Fan | 2003-01-14 |
| 6501941 | Method for identifying growth limits of handheld services for mobile satellite communications | Donald C. D. Chang, Kar W. Yung, Urban A. Von Der Embse, John I. Novak, III, Frank Taormina +1 more | 2002-12-31 |
| 6483672 | Track width control of readback elements with ions implantation in a bounding region of tip portion to selectively deactivate magnetic sensitivity thereof | Patrick Clinton Arnett, Sakhrat Khizroev, David A. Thompson | 2002-11-19 |
| 6460808 | Satellite system and method of deploying same | Frank Taormina, Donald C. D. Chang, Kar W. Yung, William W. Mayfield, John I. Novak, III +1 more | 2002-10-08 |
| 6353999 | Method of making mechanical-laser structure | — | 2002-03-12 |
| 6336612 | Satellite system and method of deploying same | Frank Taormina, Donald C. D. Chang, Kar W. Yung, William W. Mayfield, John I. Novak, III +1 more | 2002-01-08 |
| 6327872 | Method and apparatus for producing a pressurized high purity liquid carbon dioxide stream | Robert W. Boyd, Jessi Lynn Pike, Kelly Leitch | 2001-12-11 |
| 6313790 | Method and system for determining a position of a transceiver in a communications network | Donald C. D. Chang, Kar W. Yung, William J. Nunan, Bruce Shuman | 2001-11-06 |