Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6749737 | Method of fabricating inter-layer solid conductive rods | Chang-Chin Hsieh, Chih-Peng Fan, Chih-Hao Yeh | 2004-06-15 |
| 6709897 | Method of forming IC package having upward-facing chip cavity | Chih-Peng Fan, David C. H. Cheng | 2004-03-23 |
| 6673652 | Underfilling method for a flip-chip packaging process | Ming-Hsien Chen | 2004-01-06 |
| 6506633 | Method of fabricating a multi-chip module package | Chih-Peng Fan, David C. H. Cheng | 2003-01-14 |
| 6506632 | Method of forming IC package having downward-facing chip cavity | Chih-Peng Fan, David C. H. Cheng | 2003-01-14 |
| 6448170 | Method of producing external connector for substrate | Chang-Chin Hsieh, Bang-Chiung Liu, Chung-Yuan Chiu | 2002-09-10 |
| 6395633 | Method of forming micro-via | Chang-Chin Hsieh, Chih-Peng Fan, Chin-Chung Chang | 2002-05-28 |
| 6384613 | Wafer burn-in testing method | Ming-Hsien Chen | 2002-05-07 |