Issued Patents All Time
Showing 51–75 of 99 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9485863 | Carrier and method for fabricating coreless packaging substrate | Chung W. Ho, Dyi-Chung Hu, Huan-Ling Lee, Sheng-Yuah He | 2016-11-01 |
| 9484223 | Coreless packaging substrate and method of fabricating the same | Chung W. Ho | 2016-11-01 |
| 9460992 | Packaging substrate having a through-holed interposer | Dyi-Chung Hu, Ying-Chih Chan | 2016-10-04 |
| 9370107 | Embedded component structure and process thereof | Wei-Ming Cheng | 2016-06-14 |
| 9357659 | Packaging substrate having embedded through-via interposer | Dyi-Chung Hu | 2016-05-31 |
| 9337136 | Method of fabricating a through-holed interposer | Dyi-Chung Hu, Ying-Chih Chan | 2016-05-10 |
| 9282646 | Interposed substrate and manufacturing method thereof | Dyi-Chung Hu, Ming-Chih Chen | 2016-03-08 |
| 9257379 | Coreless packaging substrate and method of fabricating the same | Chung W. Ho | 2016-02-09 |
| 9224683 | Method of fabricating packaging substrate having a through-holed interposer | Dyi-Chung Hu, Ying-Chih Chan | 2015-12-29 |
| 9161454 | Electrical device package structure and method of fabricating the same | Shu-Sheng Chiang, Tsung-Yuan Chen, Shih-Lian Cheng | 2015-10-13 |
| 9111948 | Method of fabricating semiconductor package structure | Dyi-Chung Hu, Yu-Shan Hu | 2015-08-18 |
| 9070616 | Method of fabricating packaging substrate | Chung W. Ho | 2015-06-30 |
| D729961 | Lighting bulb | Yung-Cheng Sung, Chung Wu | 2015-05-19 |
| 8981570 | Through-holed interposer, packaging substrate, and methods of fabricating the same | Dyi-Chung Hu, Ying-Chih Chan | 2015-03-17 |
| 8956909 | Method of fabricating an electronic device comprising photodiode | Dyi-Chung Hu | 2015-02-17 |
| 8952268 | Interposed substrate and manufacturing method thereof | Dyi-Chung Hu, Ming-Chih Chen | 2015-02-10 |
| 8946564 | Packaging substrate having embedded through-via interposer and method of fabricating the same | Dyi-Chung Hu | 2015-02-03 |
| 8912642 | Packaging substrate and fabrication method thereof | Chung W. Ho | 2014-12-16 |
| 8859912 | Coreless package substrate and fabrication method thereof | Chung W. Ho | 2014-10-14 |
| 8835992 | Electronic device comprising electrical contact pads | Dyi-Chung Hu | 2014-09-16 |
| 8709865 | Fabrication method of packaging substrate having through-holed interposer embedded therein | Yu-Shan Hu, Dyi-Chung Hu | 2014-04-29 |
| 8633061 | Method of fabricating package structure | Dyi-Chung Hu, Yu-Shan Hu | 2014-01-21 |
| 8624382 | Packaging substrate and method of fabricating the same | Chung W. Ho | 2014-01-07 |
| 8624366 | Semiconductor package structure and method of fabricating the same | Dyi-Chung Hu, Yu-Shan Hu | 2014-01-07 |
| 8598463 | Circuit board and manufacturing method thereof | Chang-Ming Lee, Wen-Fang Liu, Cheng-Po Yu | 2013-12-03 |