Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9491871 | Carrier substrate | Chun-Ting Lin | 2016-11-08 |
| 9460992 | Packaging substrate having a through-holed interposer | Tzyy-Jang Tseng, Dyi-Chung Hu | 2016-10-04 |
| 9408313 | Packaging substrate and method of fabricating the same | Chun-Ting Lin | 2016-08-02 |
| 9337136 | Method of fabricating a through-holed interposer | Tzyy-Jang Tseng, Dyi-Chung Hu | 2016-05-10 |
| 9224683 | Method of fabricating packaging substrate having a through-holed interposer | Tzyy-Jang Tseng, Dyi-Chung Hu | 2015-12-29 |
| 9111818 | Packaging substrate | Chun-Ting Lin, Yu-Chung Hsieh, Ying-Tung Wang | 2015-08-18 |
| 8981570 | Through-holed interposer, packaging substrate, and methods of fabricating the same | Tzyy-Jang Tseng, Dyi-Chung Hu | 2015-03-17 |
| 8502370 | Stack package structure and fabrication method thereof | Jiun-Ting Lin | 2013-08-06 |