Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9591753 | Circuit board and manufacturing method thereof | Chin-Sheng Wang, Ching-Sheng Chen, Ching-Ta Chen | 2017-03-07 |
| 7658970 | Noble metal layer formation for copper film deposition | Ling Chen | 2010-02-09 |