Issued Patents All Time
Showing 26–50 of 75 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10211139 | Chip package structure | Tzyy-Jang Tseng, Yu-Hua Chen | 2019-02-19 |
| 10178755 | Circuit board stacked structure and method for forming the same | Kai-Ming Yang, Chien-Tsai Li | 2019-01-08 |
| 10141224 | Manufacturing method of interconnection structure | Dyi-Chung Hu, Yin-Po Hung, Yu-Hua Chen | 2018-11-27 |
| 9859159 | Interconnection structure and manufacturing method thereof | Dyi-Chung Hu, Yin-Po Hung, Yu-Hua Chen | 2018-01-02 |
| 9368442 | Method for manufacturing an interposer, interposer and chip package structure | Dyi-Chung Hu, Yu-Hua Chen | 2016-06-14 |
| 9111774 | Wafer-to-wafer stack with supporting post | Chi-Shih Chang, Shyi-Ching Liau, Wei-Chung Lo, Rong-Shen Lee | 2015-08-18 |
| 8810031 | Wafer-to-wafer stack with supporting pedestal | Chi-Shih Chang, Shyi-Ching Liau, Wei-Chung Lo, Rong-Shen Lee | 2014-08-19 |
| 8673658 | Fabricating method of semiconductor device | Ming-Che Hsieh, John Hon-Shing Lau | 2014-03-18 |
| 8674491 | Semiconductor device | Chun-Kai Liu, John Hon-Shing Lau, Ming-Ji Dai | 2014-03-18 |
| 8552554 | Heat dissipation structure for electronic device and fabrication method thereof | Ming-Ji Dai, Yon-Hua Tzeng | 2013-10-08 |
| 8546924 | Package structures for integrating thermoelectric components with stacking chips | Chih-Kuang Yu, Chun-Kai Liu | 2013-10-01 |
| 8536701 | Electronic device packaging structure | Ming-Ji Dai, John Hon-Shing Lau | 2013-09-17 |
| 8519524 | Chip stacking structure and fabricating method of the chip stacking structure | Sheng-Tsai Wu, John Hon-Shing Lau, Heng-Chieh Chien, Ming-Ji Dai, Yu-Lin Chao | 2013-08-27 |
| 8507909 | Measuring apparatus that includes a chip with a through silicon via, a heater having plural switches, and a stress sensor | Ming-Ji Dai, Shyh-Shyuan Sheu, Chih-Sheng Lin, Shih-Hsien Wu | 2013-08-13 |
| 8502224 | Measuring apparatus that includes a chip having a through silicon via, a heater, and a stress sensor | John Hon-Shing Lau, Ming-Che Hsieh, Wei Li, Ming-Ji Dai | 2013-08-06 |
| 8456017 | Filled through-silicon via with conductive composite material | Ming-Ji Dai, Heng-Chieh Chien, Ming-Che Hsieh, Jui-Feng Hung, John Hon-Shing Lau | 2013-06-04 |
| 8438847 | Heat-pipe electric power generating device and hydrogen/oxygen gas generating apparatus and internal combustion engine system having the same | Yao-Shun Chen, Wen-Yang Peng | 2013-05-14 |
| 8418456 | Heat-pipe electric power generating device and hydrogen/oxygen gas generating apparatus and internal combustion engine system having the same | Wen-Yang Peng, Yao-Shun Chen | 2013-04-16 |
| 8408747 | Light emitting devices having heat-dissipating surface | Kung-Hsia Wang, Ping-Hsin Hsia, Hsien-Chang Lee, Shu-Jung Yang, Chao-Hsien Chang | 2013-04-02 |
| 8397584 | Fabricating method and testing method of semiconductor device and mechanical integrity testing apparatus | Ming-Che Hsieh, John Hon-Shing Lau | 2013-03-19 |
| 8288655 | Circuit board structure and manufacturing method thereof | Ming-Ji Dai | 2012-10-16 |
| 8283613 | Heat-pipe electric-power generating device | Shu-Jung Yang, Yu-Lin Chao, Yao-Shun Chen, Shyi-Ching Liau | 2012-10-09 |
| 8278755 | Heat dissipation structure for electronic device and fabrication method thereof | Ming-Ji Dai, I-Nan Lin | 2012-10-02 |
| RE43626 | LED lamp | Tzong-Che Ho, Shyi-Ching Liau | 2012-09-04 |
| 8164165 | Wafer-to-wafer stack with supporting pedestal | Chi-Shih Chang, Shyi-Ching Liau, Wei-Chung Lo, Rong-Shen Lee | 2012-04-24 |