Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8456017 | Filled through-silicon via with conductive composite material | Ming-Ji Dai, Heng-Chieh Chien, Ming-Che Hsieh, Ra-Min Tain, John Hon-Shing Lau | 2013-06-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8456017 | Filled through-silicon via with conductive composite material | Ming-Ji Dai, Heng-Chieh Chien, Ming-Che Hsieh, Ra-Min Tain, John Hon-Shing Lau | 2013-06-04 |