Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9184334 | LED structure | Chih-Kuang Yu, Ken Wen-Chien Fu, Hung-Yi Kuo, Hung-Chao Kao, Ming-Feng Wu +1 more | 2015-11-10 |
| 8809899 | LED structure | Chih-Kuang Yu, Ken Wen-Chien Fu, Hung-Yi Kuo, Hung-Chao Kao, Ming-Feng Wu +1 more | 2014-08-19 |
| 8587018 | LED structure having embedded zener diode | Chih-Kuang Yu, Ken Wen-Chien Fu, Hung-Yi Kuo, Hung-Chao Kao, Ming-Feng Wu +1 more | 2013-11-19 |
| 6495408 | Local interconnection process for preventing dopant cross diffusion in shared gate electrodes | Jiunn-Yann Tsai | 2002-12-17 |
| 6424019 | Shallow trench isolation chemical-mechanical polishing process | Yanhua Wang, Jayanthi Pallinti | 2002-07-23 |
| 6174798 | Process for forming metal interconnect stack for integrated circuit structure | Zhihai Wang, Fred Chen | 2001-01-16 |
| 6147409 | Modified multilayered metal line structure for use with tungsten-filled vias in integrated circuit structures | Fred Chen, Jiunn-Yann Tsai | 2000-11-14 |
| 6087726 | Metal interconnect stack for integrated circuit structure | Zhihai Wang, Fred Chen | 2000-07-11 |
| 6060370 | Method for shallow trench isolations with chemical-mechanical polishing | Yanhua Wang, Jayanthi Pallinti | 2000-05-09 |
| 6046113 | Combined dry and wet etch for improved silicide formation | Qi-Zhong Hong | 2000-04-04 |
| 6037262 | Process for forming vias, and trenches for metal lines, in multiple dielectric layers of integrated circuit structure | Jiunn-Yann Tsai | 2000-03-14 |
| 6034401 | Local interconnection process for preventing dopant cross diffusion in shared gate electrodes | Jiunn-Yann Tsai | 2000-03-07 |