Issued Patents All Time
Showing 51–75 of 77 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9391067 | Multiple silicide integration structure and method | Der-Chyang Yeh, Hao-Hsun Lin, Chih-Ping Chao, Chin-Hao Su, Hsi-Kuei Cheng | 2016-07-12 |
| 9379299 | LED device with improved thermal performance | Chih-Kuang Yu, Hung-Yi Kuo, Chyi Shyuan Chern | 2016-06-28 |
| 9312432 | Growing an improved P-GaN layer of an LED through pressure ramping | Ming-Hua Lo, Zhen Li, Hao-Chung Kuo | 2016-04-12 |
| 9224636 | Methods of forming through silicon via openings | Chyi Shyuan Chern, Hsin-Hsien Wu, Chun-Lin Chang, Hung-Yi Kuo | 2015-12-29 |
| 9117968 | Light-emitting diode structure | Ching-Hua Chiu | 2015-08-25 |
| 9099593 | III-V group compound devices with improved efficiency and droop rate | Zhen Li, Hon-Way Lin, Chung-Pao Lin, Hao-Chung Kuo | 2015-08-04 |
| 9099632 | Light emitting diode emitter substrate with highly reflective metal bonding | Chyi Shyuan Chern, Wen-Chien Fu, Chih-Kuang Yu, Ching-Hua Chiu, Hung-Yi Kuo | 2015-08-04 |
| 9065015 | Forming light-emitting diodes using seed particles | Jung-Tang Chu, Ching-Hua Chiu, Hung-Wen Huang, Yea-Chen Lee | 2015-06-23 |
| 8993393 | Multiple silicide integration structure and method | Der-Chyang Yeh, Hao-Hsun Lin, Chih-Ping Chao, Chin-Hao Su, Hsi-Kuei Cheng | 2015-03-31 |
| 8993447 | LED device with improved thermal performance | Chih-Kuang Yu, Hung-Yi Kuo, Chyi Shyuan Chern | 2015-03-31 |
| 8981534 | Pre-cutting a back side of a silicon substrate for growing better III-V group compound layer on a front side of the substrate | Zhen Li, Chung-Pao Lin, Hao-Chung Kuo, Cindy Huichun Shu, Hsin-Chieh Huang | 2015-03-17 |
| 8912033 | Dicing-free LED fabrication | Chih-Kuang Yu, Gordon Kuo | 2014-12-16 |
| 8716128 | Methods of forming through silicon via openings | Chyi Shyuan Chern, Hsin-Hsien Wu, Chun-Lin Chang, Hung-Yi Kuo | 2014-05-06 |
| 8653542 | Micro-interconnects for light-emitting diodes | Chih-Kuang Yu | 2014-02-18 |
| 8618564 | High efficiency light emitting diodes | Jung-Tang Chu, Ching-Hua Chiu | 2013-12-31 |
| 8598617 | Methods of fabricating light emitting diode packages | Chih-Kuang Yu, Chyi Shyuan Chern, Hung-Yi Kuo | 2013-12-03 |
| 8592242 | Etching growth layers of light emitting devices to reduce leakage current | Hung-Wen Huang, Ching-Hua Chiu | 2013-11-26 |
| 8563334 | Method to remove sapphire substrate | Hung-Wen Huang, Ching-Hua Chiu | 2013-10-22 |
| 8546165 | Forming light-emitting diodes using seed particles | Jung-Tang Chu, Ching-Hua Chiu, Hung-Wen Huang, Yea-Chen Lee | 2013-10-01 |
| 8519538 | Laser etch via formation | Chih-Kuang Yu, Ching-Hua Chiu, Troy Wu | 2013-08-27 |
| 8519409 | Light emitting diode components integrated with thermoelectric devices | Chih-Kuang Yu | 2013-08-27 |
| 8476659 | Light emitting device | Hung-Weng Huang, Ching-Hua Chiu, Gordon Kuo | 2013-07-02 |
| 8415684 | LED device with improved thermal performance | Chih-Kuang Yu, Gordon Kuo, Chyi Shyuan Chern | 2013-04-09 |
| 8415183 | Wafer level conformal coating for LED devices | Chih-Kuang Yu, Hung-Yi Kuo, Hung-Wen Huang | 2013-04-09 |
| 8409965 | Method and structure for LED with nano-patterned substrate | Ching-Hua Chiu | 2013-04-02 |