Issued Patents All Time
Showing 51–75 of 292 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11990351 | Semiconductor package and manufacturing method thereof | Jiun-Ting Chen, Chih-Wei Wu, Tsung-Fu Tsai, Ying-Ching Shih, Ting-Yu Yeh +1 more | 2024-05-21 |
| 11990429 | Dummy die placement without backside chipping | Chih-Wei Wu, Ying-Ching Shih, Kung-Chen Yeh, Li-Chung Kuo, Pu Wang | 2024-05-21 |
| 11973005 | Coplanar control for film-type thermal interface | Yu-Hsun Wang, Ping-Yin Hsieh, Pu Wang, Li-Hui Cheng | 2024-04-30 |
| 11967546 | Giga interposer integration through Chip-On-Wafer-On-Substrate | Shang-Yun Hou, Hsien-Pin Hu, Sao-Ling Chiu, Wen-Hsin Wei, Ping-Kang Huang +5 more | 2024-04-23 |
| 11955459 | Package structure | Shu-Hang Liao, Chih-Wei Wu, Jing-Cheng Lin, Ying-Ching Shih | 2024-04-09 |
| 11948930 | Semiconductor package and method of manufacturing the same | Chin-Chuan Chang, Chen-Hua Yu | 2024-04-02 |
| 11948896 | Package structure | Tsung-Fu Tsai, Kung-Chen Yeh, I-Ting Huang, Shih-Ting Lin | 2024-04-02 |
| 11942403 | Integrated circuit package and method | Chih-Chien Pan, Li-Hui Cheng, Chin-Fu Kao | 2024-03-26 |
| 11935842 | Methods of manufacturing an integrated circuit having stress tuning layer | Shin-Puu Jeng, Clinton Chao | 2024-03-19 |
| 11929261 | Semiconductor package and method of manufacturing the same | Chin-Chuan Chang, Chen-Hua Yu | 2024-03-12 |
| 11923259 | Package structure and method of manufacturing the same | Pu Wang, Li-Hui Cheng, Tsung-Fu Tsai | 2024-03-05 |
| 11901255 | Semiconductor device and method of forming the same | Chih-Chien Pan, Chin-Fu Kao, Li-Hui Cheng | 2024-02-13 |
| 11894287 | Adhesive and thermal interface material on a plurality of dies covered by a lid | Chih-Hao Chen, Chin-Fu Kao, Li-Hui Cheng, Chih-Chien Pan | 2024-02-06 |
| 11862523 | Apparatus for detecting end point | Yi-Chao Mao, Chin-Chuan Chang | 2024-01-02 |
| 11854984 | Semiconductor package and manufacturing method thereof | Chen-Hsuan Tsai, Chin-Chuan Chang, Tsung-Fu Tsai | 2023-12-26 |
| 11855003 | Package structure and method of fabricating the same | Pu Wang, Li-Hui Cheng, Hsien-Ju Tsou | 2023-12-26 |
| 11855060 | Package structure and method of fabricating the same | Tsung-Fu Tsai, Chin-Fu Kao, Pu Wang | 2023-12-26 |
| 11855054 | Method of forming package structure | Chih-Chien Pan, Chin-Fu Kao, Li-Hui Cheng | 2023-12-26 |
| 11842936 | Underfill structure for semiconductor packages and methods of forming the same | Yu-Wei Chen, Li-Chung Kuo, Ying-Ching Shih, Jing-Cheng Lin, Long Hua Lee +1 more | 2023-12-12 |
| 11830821 | Semiconductor devices and methods of manufacture | Chih-Hao Chen, Pu Wang, Li-Hui Cheng | 2023-11-28 |
| 11824040 | Package component, electronic device and manufacturing method thereof | Chih-Wei Wu, Ying-Ching Shih | 2023-11-21 |
| 11817425 | Package structure with underfill | Chen-Hsuan Tsai, Tsung-Fu Tsai, Shih-Ting Lin | 2023-11-14 |
| 11817410 | Integrated circuit package and method | Wen-Chih Chiou, Chen-Hua Yu, Shih-Ting Lin | 2023-11-14 |
| 11810831 | Integrated circuit package and method of forming same | Chen-Hua Yu, Chih-Wei Wu, Ying-Ching Shih | 2023-11-07 |
| 11804468 | Manufacturing method of semiconductor package using jig | Chih-Hao Chen, Chih-Chien Pan, Pu Wang, Li-Hui Cheng | 2023-10-31 |