Issued Patents All Time
Showing 76–100 of 292 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11769739 | Package structure and manufacturing method thereof | Tsung-Fu Tsai, Shih-Ting Lin, Chen-Hsuan Tsai, I-Ting Huang | 2023-09-26 |
| 11756855 | Method of fabricating package structure | Chih-Hao Chen, Chin-Fu Kao, Li-Hui Cheng | 2023-09-12 |
| 11749607 | Package and method of manufacturing the same | Chih-Wei Wu, Chen-Hua Yu, Kuo-Chung Yee, Ying-Ching Shih | 2023-09-05 |
| 11742323 | Semiconductor structure and method of forming the same | Chih-Chien Pan, Pu Wang, Li-Hui Cheng, An-Jhih Su | 2023-08-29 |
| 11728254 | Giga interposer integration through chip-on-wafer-on-substrate | Shang-Yun Hou, Hsien-Pin Hu, Sao-Ling Chiu, Wen-Hsin Wei, Ping-Kang Huang +5 more | 2023-08-15 |
| 11728190 | System for thinning substrate | Yi-Chao Mao, Chin-Chuan Chang | 2023-08-15 |
| 11705381 | High efficiency heat dissipation using thermal interface material film | Chih-Hao Chen, Hung-Yu Chen, Pu Wang, Li-Hui Cheng | 2023-07-18 |
| 11699597 | Package structure and manufacturing method thereof | Li-Hui Cheng, Ping-Yin Hsieh, Chih-Hao Chen | 2023-07-11 |
| 11694975 | Chip package structure | Jiun-Ting Chen, Ying-Ching Shih, Chih-Wei Wu | 2023-07-04 |
| 11682645 | Plurality of stacked pillar portions on a semiconductor structure | Jung-Hua Chang, Ying-Ching Shih | 2023-06-20 |
| 11670593 | Package-on-package (POP) electronic device and manufacturing method thereof | Tsung-Fu Tsai, Hou-Ju Huang, Shih-Ting Lin, Hung-Wei Tsai | 2023-06-06 |
| 11670597 | Method for forming package structure | Chin-Chuan Chang | 2023-06-06 |
| 11664286 | Method for forming package structure | Chih-Hao Chen, Chih-Chien Pan, Li-Hui Cheng, Chin-Fu Kao | 2023-05-30 |
| 11637086 | Sawing underfill in packaging processes | Ying-Da Wang, Li-Chung Kuo, Jing-Cheng Lin | 2023-04-25 |
| 11631654 | Sawing underfill in packaging processes | Ying-Da Wang, Li-Chung Kuo, Jing-Cheng Lin | 2023-04-18 |
| 11626344 | Adhesive and thermal interface material on a plurality of dies covered by a lid | Chih-Hao Chen, Chin-Fu Kao, Li-Hui Cheng, Chih-Chien Pan | 2023-04-11 |
| 11621205 | Underfill structure for semiconductor packages and methods of forming the same | Yu-Wei Chen, Li-Chung Kuo, Ying-Ching Shih, Jing-Cheng Lin, Long Hua Lee +1 more | 2023-04-04 |
| 11616034 | Integrated circuit structure, and method for forming thereof | Yi-Chao Mao, Chin-Chuan Chang, Kun-Tong Tsai, Hung Chih Chen | 2023-03-28 |
| 11600595 | Semiconductor package and manufacturing method thereof | Ying-Ching Shih, Chih-Wei Wu | 2023-03-07 |
| 11574872 | Package structure and method of manufacturing the same | Shih-Ting Lin | 2023-02-07 |
| 11562941 | Semiconductor packages having thermal conductive patterns surrounding the semiconductor die | Jing-Cheng Lin | 2023-01-24 |
| 11557568 | Package and manufacturing method thereof | Chih-Wei Wu, Ying-Ching Shih | 2023-01-17 |
| 11527454 | Package structures and methods of forming the same | Chen-Hua Yu, Wen-Hsin Wei, Chi-Hsi Wu, Shang-Yun Hou, Jing-Cheng Lin +2 more | 2022-12-13 |
| 11521905 | Package structure and method of manufacturing the same | Pu Wang, Li-Hui Cheng, Tsung-Fu Tsai | 2022-12-06 |
| 11515267 | Dummy die placement without backside chipping | Chih-Wei Wu, Li-Chung Kuo, Pu Wang, Ying-Ching Shih, Kung-Chen Yeh | 2022-11-29 |