Issued Patents All Time
Showing 26–50 of 66 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502040 | Package structure and semiconductor pacakge | Jung-Hua Chang | 2022-11-15 |
| 11495526 | Integrated circuit package and method | Chih-Chien Pan, Li-Hui Cheng, Szu-Wei Lu | 2022-11-08 |
| 11476219 | Metal-bump sidewall protection | Jung-Hua Chang, Jian-Yang He | 2022-10-18 |
| 11456287 | Package structure and method of fabricating the same | Hsien-Pin Hu, Li-Hui Cheng, Szu-Wei Lu, Wen-Hsin Wei, Chih-Chien Pan | 2022-09-27 |
| 11456268 | Semiconductor package and manufacturing method thereof | Jung-Hua Chang | 2022-09-27 |
| 11450654 | Package structure and method of fabricating the same | Tsung-Fu Tsai, Pu Wang, Szu-Wei Lu | 2022-09-20 |
| 11424174 | Semiconductor device and method of forming the same | Chih-Chien Pan, Li-Hui Cheng, Szu-Wei Lu | 2022-08-23 |
| 11302683 | Optical signal processing package structure | Chih-Chien Pan, Li-Hui Cheng, Szu-Wei Lu | 2022-04-12 |
| 11296051 | Semiconductor packages and forming method thereof | Chih-Yuan Chien, Li-Hui Cheng, Szu-Wei Lu | 2022-04-05 |
| 11289399 | Package structure and manufacturing method thereof | Pu Wang, Szu-Wei Lu | 2022-03-29 |
| 11239134 | Package structure and method of fabricating the same | Chih-Hao Chen, Li-Hui Cheng, Szu-Wei Lu | 2022-02-01 |
| 11239136 | Adhesive and thermal interface material on a plurality of dies covered by a lid | Chih-Hao Chen, Li-Hui Cheng, Szu-Wei Lu, Chih-Chien Pan | 2022-02-01 |
| 11205612 | Integrated circuit package and method | Chih-Chien Pan, Li-Hui Cheng, Szu-Wei Lu | 2021-12-21 |
| 11121051 | Semiconductor packages and method of manufacturing the same | Li-Hui Cheng, Szu-Wei Lu, Chih-Chien Pan | 2021-09-14 |
| 11101252 | Package-on-package structure and manufacturing method thereof | Shih-Ting Lin, Jing-Cheng Lin, Li-Hui Cheng, Szu-Wei Lu | 2021-08-24 |
| 11101260 | Method of forming a dummy die of an integrated circuit having an embedded annular structure | Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Hsien-Pin Hu, Yushun Lin +8 more | 2021-08-24 |
| 11062968 | Package structure and method for forming the same | Chih-Hao Chen, Chih-Chien Pan, Li-Hui Cheng, Szu-Wei Lu | 2021-07-13 |
| 11031381 | Optical transceiver and manufacturing method thereof | Chih-Hao Chen, Li-Hui Cheng, Szu-Wei Lu | 2021-06-08 |
| 11004797 | Package structure, semiconductor package and method of fabricating the same | Jung-Hua Chang | 2021-05-11 |
| 10867849 | Package-on-package structure | Li-Hui Cheng, Chih-Yuan Chien, Szu-Wei Lu | 2020-12-15 |
| 10867955 | Package structure having adhesive layer surrounded dam structure | Li-Hui Cheng, Chih-Yuan Chien, Szu-Wei Lu | 2020-12-15 |
| 10852476 | Semiconductor package, integrated optical communication system and manufacturing method of integrated optical communication system | Chih-Hao Chen, Li-Hui Cheng, Szu-Wei Lu | 2020-12-01 |
| 10796976 | Semiconductor device and method of forming the same | Chih-Chien Pan, Li-Hui Cheng, Szu-Wei Lu | 2020-10-06 |
| 10784222 | Metal-bump sidewall protection | Jung-Hua Chang, Jian-Yang He | 2020-09-22 |
| 10777531 | Package contact structure, semiconductor package and manufacturing method thereof | Jung-Hua Chang | 2020-09-15 |