Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11621235 | Structures and methods for reducing thermal expansion mismatch during integrated circuit packaging | Chien-Li Kuo | 2023-04-04 |
| 11069630 | Structures and methods for reducing thermal expansion mismatch during integrated circuit packaging | Chien-Li Kuo | 2021-07-20 |