Issued Patents All Time
Showing 26–50 of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11587900 | Package structure including IPD and method of forming the same | Hua-Wei Tseng, Yueh-Ting Lin, Shao-Yun Chen, An-Jhih Su, Ming-Shih Yeh +1 more | 2023-02-21 |
| 11545392 | Semiconductor component having through-silicon vias | Chen-Hua Yu, Cheng-Hung Chang, Ebin Liao, Chia-Lin Yu, Hsiang-Yi Wang +4 more | 2023-01-03 |
| 11502032 | Chip package and method of fabricating the same | Guan-Yu Chen, An-Jhih Su, Der-Chyang Yeh, Ming-Shih Yeh | 2022-11-15 |
| 11469218 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin +5 more | 2022-10-11 |
| 11444034 | Redistribution structure for integrated circuit package and method of forming same | Chen-Hua Yu, An-Jhih Su, Der-Chyang Yeh, Ming-Shih Yeh | 2022-09-13 |
| 11444021 | Device and package structure and method of forming the same | Hsien-Wei Chen, An-Jhih Su | 2022-09-13 |
| 11430670 | Stacked semiconductor devices and methods of forming same | Hsien-Wei Chen, Der-Chyang Yeh | 2022-08-30 |
| 11410956 | Chip package structure with bump | Wei-Yu Chen, An-Jhih Su, Hsien-Wei Chen | 2022-08-09 |
| 11217570 | Package structure and manufacturing method thereof | Wei-Yu Chen, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Po-Hao Tsai +2 more | 2022-01-04 |
| 11201142 | Semiconductor package, package on package structure and method of froming package on package structure | Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Hua-Wei Tseng, Ming-Chih Yew +2 more | 2021-12-14 |
| 11177142 | Method for dicing integrated fan-out packages without seal rings | Yueh-Ting Lin, An-Jhih Su, Ming-Shih Yeh, Der-Chyang Yeh | 2021-11-16 |
| 11164832 | Package with UBM and methods of forming | Hsien-Wei Chen | 2021-11-02 |
| 11158619 | Redistribution layers in semiconductor packages and methods of forming same | An-Jhih Su, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh | 2021-10-26 |
| 11152323 | Package with UBM and methods of forming | Chen-Hua Yu, Chien-Yu Li, Hung-Jui Kuo, Hsien-Wei Chen, Der-Chyang Yeh +2 more | 2021-10-19 |
| 11145633 | Semiconductor package and manufacturing method thereof | Wei-Yu Chen, An-Jhih Su, Tien-Chung Yang, Ming-Shih Yeh | 2021-10-12 |
| 11088094 | Air channel formation in packaging process | Wan-Yu Lee, Chiang Lin, Yueh-Ting Lin, Hua-Wei Tseng, Yu-Hsiang Hu | 2021-08-10 |
| 11075150 | Semiconductor package and method of manufacturing the same | An-Jhih Su, Der-Chyang Yeh, Hua-Wei Tseng, Chiang-Hung Lin, Ming-Shih Yeh | 2021-07-27 |
| 11062978 | Semiconductor package and method | Wei-Yu Chen, An-Jhih Su, Der-Chyang Yeh, Ming-Shih Yeh | 2021-07-13 |
| 11037899 | Package structures and methods of forming the same | An-Jhih Su, Hsien-Wei Chen | 2021-06-15 |
| 11018025 | Redistribution lines having stacking vias | Hsien-Wei Chen | 2021-05-25 |
| 11004818 | Package with passive devices and method of forming the same | Shuo-Mao Chen, Der-Chyang Yeh | 2021-05-11 |
| 10950575 | Package structure and method of forming the same | Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen, An-Jhih Su +1 more | 2021-03-16 |
| 10879224 | Package structure, die and method of manufacturing the same | Wei-Yu Chen, An-Jhih Su, Der-Chyang Yeh, Hua-Wei Tseng, Ming-Shih Yeh | 2020-12-29 |
| 10872855 | Chip package and method of fabricating the same | Guan-Yu Chen, An-Jhih Su, Der-Chyang Yeh, Ming-Shih Yeh | 2020-12-22 |
| 10867928 | Semiconductor device and manufacturing method thereof | Kuan-Chung Lu, An-Jhih Su, Der-Chyang Yeh, Yueh-Ting Lin, Ming-Shih Yeh | 2020-12-15 |