Issued Patents All Time
Showing 51–75 of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10854565 | Chip package structure with bump | Wei-Yu Chen, An-Jhih Su, Hsien-Wei Chen | 2020-12-01 |
| 10847383 | Stacked semiconductor devices and methods of forming same | Hsien-Wei Chen, Der-Chyang Yeh | 2020-11-24 |
| 10825780 | Semiconductor device with electromagnetic interference protection and method of manufacture | Chi-Hsi Wu, Hsien-Wei Chen, Tien-Chung Yang | 2020-11-03 |
| 10811394 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin +5 more | 2020-10-20 |
| 10784162 | Method of making a semiconductor component having through-silicon vias | Chen-Hua Yu, Cheng-Hung Chang, Ebin Liao, Chia-Lin Yu, Hsiang-Yi Wang +4 more | 2020-09-22 |
| 10756037 | Package structure and fabricating method thereof | An-Jhih Su, Der-Chyang Yeh, Hua-Wei Tseng, Yueh-Ting Lin, Ming-Shih Yeh | 2020-08-25 |
| 10741490 | Device and package structure | Hsien-Wei Chen, An-Jhih Su | 2020-08-11 |
| 10734357 | Chip package structure with molding layer | Wei-Yu Chen, An-Jhih Su, Hsien-Wei Chen | 2020-08-04 |
| 10727211 | Package structure with dummy die | Hsien-Wei Chen | 2020-07-28 |
| 10720409 | Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same | Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen, Yueh-Ting Lin, Wei-Yu Chen +1 more | 2020-07-21 |
| 10700026 | Package with UBM and methods of forming | Hsien-Wei Chen | 2020-06-30 |
| 10700032 | Package with passive devices and method of forming the same | Shuo-Mao Chen, Der-Chyang Yeh | 2020-06-30 |
| 10672734 | Package structures and methods of forming the same | An-Jhih Su, Hsien-Wei Chen | 2020-06-02 |
| 10672741 | Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same | Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen, Yueh-Ting Lin, Wei-Yu Chen +1 more | 2020-06-02 |
| 10636775 | Package structure and manufacturing method thereof | Wei-Yu Chen, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Po-Hao Tsai +2 more | 2020-04-28 |
| 10541226 | Package structure and method of forming the same | Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen, An-Jhih Su +1 more | 2020-01-21 |
| 10529650 | Semiconductor package and method | Wei-Yu Chen, An-Jhih Su, Der-Chyang Yeh, Ming-Shih Yeh | 2020-01-07 |
| 10522473 | Alignment mark design for packages | Hsien-Wei Chen, Ching-Wen Hsiao, Der-Chyang Yeh, Shin-Puu Jeng, Chen-Hua Yu | 2019-12-31 |
| 10510562 | Stacked semiconductor devices and methods of forming same | Hsien-Wei Chen, Der-Chyang Yeh | 2019-12-17 |
| 10373923 | Package with passive devices and method of forming the same | Shuo-Mao Chen, Der-Chyang Yeh | 2019-08-06 |
| 10347606 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin +5 more | 2019-07-09 |
| 10304801 | Redistribution layers in semiconductor packages and methods of forming same | An-Jhih Su, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh | 2019-05-28 |
| 10290610 | PoP device and method of forming the same | An-Jhih Su, Der-Chyang Yeh, Hua-Wei Tseng, Li-Hui Cheng, Po-Hao Tsai +2 more | 2019-05-14 |
| 10283479 | Package structures and methods of forming the same | An-Jhih Su, Hsien-Wei Chen | 2019-05-07 |
| 10276549 | Package structure with dummy die | Hsien-Wei Chen | 2019-04-30 |