Issued Patents All Time
Showing 76–100 of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10276542 | Package structure and manufacturing method thereof | An-Jhih Su, Hsien-Wei Chen, Hua-Wei Tseng, Jo-Mei Wang, Tien-Chung Yang +1 more | 2019-04-30 |
| 10269752 | Package with UBM and methods of forming | Chen-Hua Yu, Chien-Yu Li, Hung-Jui Kuo, Hsien-Wei Chen, Der-Chyang Yeh +2 more | 2019-04-23 |
| 10269723 | Alignment mark design for packages | Hsien-Wei Chen, Ching-Wen Hsiao, Der-Chyang Yeh, Shin-Puu Jeng, Chen-Hua Yu | 2019-04-23 |
| 10217687 | Semiconductor device and manufacturing method thereof | Tien-Chung Yang, Lin-Chih Huang, Hsien-Wei Chen, An-Jhih Su | 2019-02-26 |
| 10163803 | Integrated fan-out packages and methods of forming the same | Wei-Yu Chen, An-Jhih Su, Der-Chyang Yeh, Ming-Shih Yeh | 2018-12-25 |
| 10163701 | Multi-stack package-on-package structures | Chi-Jung Lee, Hsien-Wei Chen, An-Jhih Su, Wei-Yu Chen, Tien-Chung Yang | 2018-12-25 |
| 10163661 | Stacked semiconductor devices and methods of forming same | Hsien-Wei Chen, Der-Chyang Yeh | 2018-12-25 |
| 10147692 | Package with UBM and methods of forming | Hsien-Wei Chen | 2018-12-04 |
| 10115634 | Semiconductor component having through-silicon vias and method of manufacture | Chen-Hua Yu, Cheng-Hung Chang, Ebin Liao, Chia-Lin Yu, Hsiang-Yi Wang +4 more | 2018-10-30 |
| 10090241 | Device, package structure and method of forming the same | Hsien-Wei Chen, An-Jhih Su | 2018-10-02 |
| 10083927 | Chip package structure with bump | Wei-Yu Chen, An-Jhih Su, Hsien-Wei Chen | 2018-09-25 |
| 9991207 | Test key strcutures, integrated circuit packages and methods of forming the same | Shao-Yun Chen, Hsien-Wei Chen | 2018-06-05 |
| 9984998 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin +5 more | 2018-05-29 |
| 9929069 | Semiconductor device and manufacturing method thereof | Tien-Chung Yang, Lin-Chih Huang, Hsien-Wei Chen, An-Jhih Su | 2018-03-27 |
| 9922964 | Package structure with dummy die | Hsien-Wei Chen | 2018-03-20 |
| 9911672 | Semiconductor devices, method for fabricating integrated fan-out packages, and method for fabricating semiconductor devices | Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen, Kuan-Chung Lu | 2018-03-06 |
| 9859245 | Chip package structure with bump and method for forming the same | Wei-Yu Chen, An-Jhih Su, Hsien-Wei Chen | 2018-01-02 |
| 9852957 | Testing, manufacturing, and packaging methods for semiconductor devices | Yung-Shou Cheng, Yan-Fu Lin, An-Jhih Su, Wei-Cheng Wu, Chin-Hsien Chen +2 more | 2017-12-26 |
| 9831200 | Package with passive devices and method of forming the same | Shuo-Mao Chen, Der-Chyang Yeh | 2017-11-28 |
| 9831215 | Semiconductor package and forming method thereof | Hsien-Wei Chen, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen | 2017-11-28 |
| 9825007 | Chip package structure with molding layer and method for forming the same | Wei-Yu Chen, An-Jhih Su, Hsien-Wei Chen | 2017-11-21 |
| 9806059 | Multi-stack package-on-package structures | Chi-Jung Lee, Hsien-Wei Chen, An-Jhih Su, Wei-Yu Chen, Tien-Chung Yang | 2017-10-31 |
| 9793246 | Pop devices and methods of forming the same | Hua-Wei Tseng, An-Jhih Su, Hsien-Wei Chen, Tien-Chung Yang | 2017-10-17 |
| 9666522 | Alignment mark design for packages | Hsien-Wei Chen, Ching-Wen Hsiao, Der-Chyang Yeh, Shin-Puu Jeng, Chen-Hua Yu | 2017-05-30 |
| 9564345 | Semiconductor device and manufacturing method thereof | Tien-Chung Yang, Lin-Chih Huang, Hsien-Wei Chen, An-Jhih Su | 2017-02-07 |