Issued Patents All Time
Showing 101–104 of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9418923 | Semiconductor component having through-silicon vias and method of manufacture | Chen-Hua Yu, Cheng-Hung Chang, Ebin Liao, Chia-Lin Yu, Hsiang-Yi Wang +4 more | 2016-08-16 |
| 8809996 | Package with passive devices and method of forming the same | Shuo-Mao Chen, Der-Chyang Yeh | 2014-08-19 |
| 8575725 | Through-silicon vias for semicondcutor substrate and method of manufacture | Chen-Hua Yu, Cheng-Hung Chang, Ebin Liao, Chia-Lin Yu, Hsiang-Yi Wang +4 more | 2013-11-05 |
| 8487410 | Through-silicon vias for semicondcutor substrate and method of manufacture | Chen-Hua Yu, Cheng-Hung Chang, Ebin Liao, Chia-Lin Yu, Hsiang-Yi Wang +4 more | 2013-07-16 |