EI

Ernesto Gutierrez, III

DL Dialog Semiconductor (Uk) Limited: 9 patents #18 of 310Top 6%
MG Mahle International Gmbh: 5 patents #173 of 1,650Top 15%
Delphi Technologies: 5 patents #650 of 4,124Top 20%
General Motors: 1 patents #9,361 of 18,328Top 55%
EC Eagle Industry Co.: 1 patents #172 of 314Top 55%
DS Dialog Semiconductor: 1 patents #157 of 293Top 55%
FU Fujikoki: 1 patents #88 of 156Top 60%
📍 Amherst, NY: #16 of 557 inventorsTop 3%
🗺 New York: #6,154 of 115,490 inventorsTop 6%
Overall (All Time): #192,471 of 4,157,543Top 5%
22
Patents All Time

Issued Patents All Time

Showing 1–22 of 22 patents

Patent #TitleCo-InventorsDate
12100674 Embedded resistor-capacitor film for fan out wafer level packaging Jesus Mennen Belonio, Jr., Shou-Cheng Hu 2024-09-24
11532489 Pillared cavity down MIS-SiP Jesus Mennen Belonio, Jr., Eric Hu, Melvin Martin, Jerry Li, Francisco Vergara Cadacio 2022-12-20
11333210 Method for controlling air-conditioning compressor, compressor and motor vehicle William R. Bradley, Richard Bottom 2022-05-17
11309255 Very thin embedded trace substrate-system in package (SIP) Jesus Mennen Belonio, Jr., Shou-Cheng Hu, Ian Kent, Melvin Martin, Rajesh Subraya Aiyandra 2022-04-19
11300219 Variable-capacity compressor control valve Masaharu Ito, Yoshiyuki Kume, Matthew R. Warren 2022-04-12
11239185 Embedded resistor-capacitor film for fan out wafer level packaging Jesus Mennen Belonio, Jr., Shou-Cheng Hu 2022-02-01
11114359 Wafer level chip scale package structure Jesus Mennen Belonio, Jr., Shou-Cheng Hu, Ian Kent, Jerry Li 2021-09-07
11075167 Pillared cavity down MIS-SIP Jesus Mennen Belonio, Jr., Eric Hu, Melvin Martin, Jerry Li, Francisco Vergara Cadacio 2021-07-27
11053933 Displacement control valve Matthew R. Warren, Daichi Kurihara, Takahiro Ejima, Wataru Takahashi, Kohei Fukudome +3 more 2021-07-06
10727174 Integrated circuit package and a method for forming a wafer level chip scale package (WLCSP) with through mold via (TMV) Jesus Mennen Belonio, Jr., Shou-Cheng Hu, Jerry Li 2020-07-28
10636742 Very thin embedded trace substrate-system in package (SIP) Jesus Mennen Belonio, Jr., Shou-Cheng Hu, Ian Kent, Melvin Martin, Rajesh Subraya Aiyandra 2020-04-28
10629507 System in package (SIP) Che-Han Li, Jesus Mennen Belonio, Jr., Shou-Cheng Hu 2020-04-21
10083926 Stress relief solutions on WLCSP large/bulk copper plane design Ian Kent, Rajesh Subraya Aiyandra, Jesus Mennen Belonio, Jr., Habeeb Mohiuddin Mohammed, Domingo Jr. Maggay +1 more 2018-09-25
9987905 Method of torque prediction for automotive air conditioning compressor Joseph M. Bona, Matthew R. Warren 2018-06-05
9309987 Electronic control valve having an integral non-contact noise mitigation device John Barrett, Timothy J. Skinner, Matthew R. Warren, Joseph M. Bona 2016-04-12
7625295 Weighted trainer golf club 2009-12-01
7611335 Two set-point pilot piston control valve Matthew R. Warren, Joseph M. Bona 2009-11-03
7063511 Integrated control valve for a variable capacity compressor Thomas Martin Urbank, Karma Vir Sangwan 2006-06-20
6732541 Electrically operated compressor capacity control system with integral pressure sensors Thomas Martin Urbank, Karma Vir Sangwan, Andrew J. Jackson, Michael Stanley Barnes 2004-05-11
6694222 Fuzzy logic control of a variable displacement compressor in a vehicle air conditioning system Sean M. Kelly, John M. Kirchberger 2004-02-17
6092380 Method for regulating the cooling performance of an air conditioning system Christopher M. Kachur, Giles M. Brandon, Ronald J. Goubeaux, Charles Andrew Archibald, Francois M. Bancon +2 more 2000-07-25
6038871 Dual mode control of a variable displacement refrigerant compressor Charles Andrew Archibald, Christopher M. Kachur, Giles M. Brandon 2000-03-21