Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12100679 | Multi-pin-wafer-level-chip-scale-packaging solution for high power semiconductor devices | Rajesh Subraya Aiyandra | 2024-09-24 |
| 11495567 | Multi-pin-wafer-level-chip-scale-packaging solution for high power semiconductor devices | Rajesh Subraya Aiyandra | 2022-11-08 |
| 10797012 | Multi-pin-wafer-level-chip-scale-packaging solution for high power semiconductor devices | Rajesh Subraya Aiyandra | 2020-10-06 |
| 10607912 | Reduction of cross talk in WLCSP's through laser drilled technique | Rajesh Subraya Aiyandra | 2020-03-31 |
| 10396004 | Reduction of cross talk in WLCSP's through laser drilled technique | Rajesh Subraya Aiyandra | 2019-08-27 |
| 10083926 | Stress relief solutions on WLCSP large/bulk copper plane design | Ian Kent, Rajesh Subraya Aiyandra, Jesus Mennen Belonio, Jr., Domingo Jr. Maggay, Robert Lamoon +1 more | 2018-09-25 |