Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12100679 | Multi-pin-wafer-level-chip-scale-packaging solution for high power semiconductor devices | Habeeb Mohiuddin Mohammed | 2024-09-24 |
| 11495567 | Multi-pin-wafer-level-chip-scale-packaging solution for high power semiconductor devices | Habeeb Mohiuddin Mohammed | 2022-11-08 |
| 11309255 | Very thin embedded trace substrate-system in package (SIP) | Jesus Mennen Belonio, Jr., Shou-Cheng Hu, Ian Kent, Ernesto Gutierrez, III, Melvin Martin | 2022-04-19 |
| 10797012 | Multi-pin-wafer-level-chip-scale-packaging solution for high power semiconductor devices | Habeeb Mohiuddin Mohammed | 2020-10-06 |
| 10764989 | Thermal enhancement of exposed die-down package | Tung Ching Lui, Baltazar Canete | 2020-09-01 |
| 10636742 | Very thin embedded trace substrate-system in package (SIP) | Jesus Mennen Belonio, Jr., Shou-Cheng Hu, Ian Kent, Ernesto Gutierrez, III, Melvin Martin | 2020-04-28 |
| 10607912 | Reduction of cross talk in WLCSP's through laser drilled technique | Habeeb Mohiuddin Mohammed | 2020-03-31 |
| 10410996 | Integrated circuit package for assembling various dice in a single IC package | Melvin Martin, Baltazar Canete, Macario Campos | 2019-09-10 |
| 10396004 | Reduction of cross talk in WLCSP's through laser drilled technique | Habeeb Mohiuddin Mohammed | 2019-08-27 |
| 10083926 | Stress relief solutions on WLCSP large/bulk copper plane design | Ian Kent, Jesus Mennen Belonio, Jr., Habeeb Mohiuddin Mohammed, Domingo Jr. Maggay, Robert Lamoon +1 more | 2018-09-25 |