Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10764989 | Thermal enhancement of exposed die-down package | Tung Ching Lui, Rajesh Subraya Aiyandra | 2020-09-01 |
| 10410996 | Integrated circuit package for assembling various dice in a single IC package | Melvin Martin, Macario Campos, Rajesh Subraya Aiyandra | 2019-09-10 |