Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354783 | Power conversion module | Yung-Hung Hsiao, Chia-Hsien Yen | 2025-07-08 |
| 12205750 | 3D MIS-FO hybrid for embedded inductor package structure | Shih-Wen Tang, Jesus Mennen Belonio, Jr. | 2025-01-21 |
| 11682965 | Power supply with lightning protection | Yung-Hung Hsiao, Chia-Hsien Yen, Cheng-Chang Hsiao, Yu-Xian Zeng | 2023-06-20 |
| 11621218 | Single side modular 3D stack up SiP with mold cavity | Shih-Wen Tang, Jesus Mennen Belonio, Jr. | 2023-04-04 |
| 10629507 | System in package (SIP) | Jesus Mennen Belonio, Jr., Ernesto Gutierrez, III, Shou-Cheng Hu | 2020-04-21 |