Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12205750 | 3D MIS-FO hybrid for embedded inductor package structure | Jesus Mennen Belonio, Jr., Che-Han Li | 2025-01-21 |
| 11621218 | Single side modular 3D stack up SiP with mold cavity | Jesus Mennen Belonio, Jr., Che-Han Li | 2023-04-04 |