Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532489 | Pillared cavity down MIS-SiP | Ernesto Gutierrez, III, Jesus Mennen Belonio, Jr., Eric Hu, Melvin Martin, Francisco Vergara Cadacio | 2022-12-20 |
| 11114359 | Wafer level chip scale package structure | Jesus Mennen Belonio, Jr., Shou-Cheng Hu, Ian Kent, Ernesto Gutierrez, III | 2021-09-07 |
| 11075167 | Pillared cavity down MIS-SIP | Ernesto Gutierrez, III, Jesus Mennen Belonio, Jr., Eric Hu, Melvin Martin, Francisco Vergara Cadacio | 2021-07-27 |
| 11008958 | Dual-fuel integrated switch | Tonny Tang | 2021-05-18 |
| 10727174 | Integrated circuit package and a method for forming a wafer level chip scale package (WLCSP) with through mold via (TMV) | Jesus Mennen Belonio, Jr., Shou-Cheng Hu, Ernesto Gutierrez, III | 2020-07-28 |
| 9960928 | System and method for topic-based eventing for flexible system management | Nick George Pope, Flemming S. Andreasen, Qi Wang | 2018-05-01 |