Issued Patents All Time
Showing 26–50 of 135 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11244919 | Package structure and method of fabricating the same | Chen-Shien Chen, Kuo-Ching Hsu, Mirng-Ji Lii | 2022-02-08 |
| 11217562 | Semiconductor device with discrete blocks | Chen-Shien Chen, Wei Sen Chang, Shou-Cheng Hu | 2022-01-04 |
| 11152273 | Conductive structures and redistribution circuit structures | Shang-Yun Tu, Sheng-Yu Wu, Ching-Hui Chen | 2021-10-19 |
| 11133274 | Fan-out interconnect structure and method for forming same | Chen-Hua Yu, Yen-Chang Hu, Mirng-Ji Lii, Chung-Shi Liu, Chien Ling Hwang +2 more | 2021-09-28 |
| 11101192 | Wafer level embedded heat spreader | Wei Sen Chang, Tsung-Hsien Chiang, Yen-Chang Hu | 2021-08-24 |
| 10978433 | Package-on-package (PoP) device with integrated passive device in a via | Chen-Shien Chen | 2021-04-13 |
| 10964610 | Packaging mechanisms for dies with different sizes of connectors | Chih-Hua Chen, Chen-Shien Chen | 2021-03-30 |
| 10879228 | Packaging mechanisms for dies with different sizes of connectors | Chih-Hua Chen, Chen-Shien Chen | 2020-12-29 |
| 10744207 | Biological complexes and methods for using same | Amy Twite, Sonny Hsiao, Cheng Liu, Hong Liu | 2020-08-18 |
| 10700025 | Fan-out interconnect structure and method for forming same | Chen-Hua Yu, Yen-Chang Hu, Mirng-Ji Lii, Chung-Shi Liu, Chien Ling Hwang +2 more | 2020-06-30 |
| 10692789 | Stacked fan-out package structure | Nai-Wei Liu, Tzu-Hung Lin, I-Hsuan Peng, Wei-Che Huang | 2020-06-23 |
| 10629580 | Packaging mechanisms for dies with different sizes of connectors | Chih-Hua Chen, Chen-Shien Chen | 2020-04-21 |
| 10629509 | Redistribution circuit structures and methods of forming the same | Shang-Yun Tu, Sheng-Yu Wu, Ching-Hui Chen | 2020-04-21 |
| 10522473 | Alignment mark design for packages | Li-Hsien Huang, Hsien-Wei Chen, Der-Chyang Yeh, Shin-Puu Jeng, Chen-Hua Yu | 2019-12-31 |
| 10515938 | Package on-package (PoP) device with integrated passive device in a via | Chen-Shien Chen | 2019-12-24 |
| 10510644 | Package structures and methods for forming the same | Ming-Da Cheng, Chih-Wei Lin, Chen-Shien Chen, Chih-Hua Chen, Chen-Cheng Kuo | 2019-12-17 |
| 10510727 | Semiconductor device with discrete blocks | Chen-Shien Chen, Wei Sen Chang, Shou-Cheng Hu | 2019-12-17 |
| 10483211 | Fan-out package structure and method for forming the same | Tzu-Hung Lin, I-Hsuan Peng, Nai-Wei Liu, Wei-Che Huang | 2019-11-19 |
| 10424563 | Semiconductor package assembly and method for forming the same | Tzu-Hung Lin, I-Hsuan Peng | 2019-09-24 |
| 10361181 | Packaging mechanisms for dies with different sizes of connectors | Chih-Hua Chen, Chen-Shien Chen | 2019-07-23 |
| 10354931 | Packaging mechanisms for dies with different sizes of connectors | Chih-Hua Chen, Chen-Shien Chen | 2019-07-16 |
| 10276525 | Package structure and method of fabricating the same | Chen-Shien Chen, Kuo-Ching Hsu, Mirng-Ji Lii | 2019-04-30 |
| 10269723 | Alignment mark design for packages | Li-Hsien Huang, Hsien-Wei Chen, Der-Chyang Yeh, Shin-Puu Jeng, Chen-Hua Yu | 2019-04-23 |
| 10256210 | Semiconductor package structure and method for forming the same | Tzu-Hung Lin, I-Hsuan Peng | 2019-04-09 |
| 10217724 | Semiconductor package assembly with embedded IPD | Tzu-Hung Lin, I-Hsuan Peng | 2019-02-26 |