Issued Patents All Time
Showing 76–100 of 135 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9576821 | Package structures including a capacitor and methods of forming the same | Sut-I Lo, Hsu-Hsien Chen, Chen-Shien Chen | 2017-02-21 |
| 9543278 | Semiconductor device with discrete blocks | Chen-Shien Chen, Wei Sen Chang, Shou-Cheng Hu | 2017-01-10 |
| 9508674 | Warpage control of semiconductor die package | Kuo Lung Pan, Chen-Shien Chen | 2016-11-29 |
| 9449941 | Connecting function chips to a package to form package-on-package | Pei-Chun Tsai, Sheng-Yu Wu, Tin-Hao Kuo, Chen-Shien Chen, Chung-Shi Liu +2 more | 2016-09-20 |
| 9418969 | Packaged semiconductor devices and packaging methods | Yen-Chang Hu, Chen-Shien Chen | 2016-08-16 |
| 9368460 | Fan-out interconnect structure and method for forming same | Chen-Hua Yu, Yen-Chang Hu, Mirng-Ji Lii, Chung-Shi Liu, Chien Ling Hwang +2 more | 2016-06-14 |
| 9355933 | Cooling channels in 3DIC stacks | Kai-Ming Ching, Tsung-Ding Wang, Ming Hung Tseng, Chen-Shien Chen | 2016-05-31 |
| 9349699 | Front side copper post joint structure for temporary bond in TSV application | Hon-Lin Huang, Kuo-Ching Hsu, Chen-Shien Chen | 2016-05-24 |
| 9330947 | Methods for forming package-on-package structures having buffer dams | Shou-Cheng Hu, Chen-Shien Chen | 2016-05-03 |
| 9324910 | Light emitting diode | Hsin-Hsien Wu, Chyi Shyuan Chern, Chun-Lin Chang, Kuang-Huan Hsu | 2016-04-26 |
| 9293449 | Methods and apparatus for package on package devices with reversed stud bump through via interconnections | Shou-Cheng Hu, Chen-Shien Chen, Tin-Hao Kuo, Chih-Hua Chen | 2016-03-22 |
| 9257332 | Through-assembly via modules and methods for forming the same | Chih-Hua Chen, Chen-Shien Chen | 2016-02-09 |
| 9258922 | PoP structures including through-assembly via modules | Chih-Hua Chen, Chen-Shien Chen | 2016-02-09 |
| 9219106 | Integrated inductor | Yen-Liang Lin, Mirng-Ji Lii, Chen-Shien Chen, Tsung-Ding Wang | 2015-12-22 |
| 9165887 | Semiconductor device with discrete blocks | Chen-Shien Chen, Wei Sen Chang, Yen-Chang Hu | 2015-10-20 |
| 9142500 | Apparatus for lead free solder interconnections for integrated circuits | Yao-Chun Chuang, Chen-Cheng Kuo, Chen-Shien Chen | 2015-09-22 |
| 9138853 | Portable optical fiber end face polisher | Chun-Kuo Wang, Shih-Tien Lin, Jui-Yu Tsai | 2015-09-22 |
| 9087832 | Warpage reduction and adhesion improvement of semiconductor die package | Yu-Chih Huang, Yen-Chang Hu, Chen-Shien Chen | 2015-07-21 |
| 9070667 | Peripheral electrical connection of package on package | Chih-Wei Lin, Wei Sen Chang, Yen-Chang Hu, Kuo Lung Pan, Yu-Chih Huang | 2015-06-30 |
| 9070644 | Packaging mechanisms for dies with different sizes of connectors | Chih-Hua Chen, Chen-Shien Chen | 2015-06-30 |
| 9040350 | Packaging and function tests for package-on-package and system-in-package structures | Hao-Juin Liu, Chita Chuang, Chen-Shien Chen, Chen-Cheng Kuo, Chih-Hua Chen | 2015-05-26 |
| 9035461 | Packaged semiconductor devices and packaging methods | Yen-Chang Hu, Chen-Shien Chen | 2015-05-19 |
| 9008506 | Fiber network events measurement apparatus | Hsuan-Hung Wu, Shih-Tien Lin, Fu-Chun Hung, Yu-Shu Chen, Ching-Lin Wu +1 more | 2015-04-14 |
| 8928114 | Through-assembly via modules and methods for forming the same | Chih-Hua Chen, Chen-Shien Chen | 2015-01-06 |
| 8922005 | Methods and apparatus for package on package devices with reversed stud bump through via interconnections | Yen-Chang Hu, Chih-Hua Chen, Chen-Shien Chen, Tin-Hao Kuo | 2014-12-30 |