CH

Ching-Wen Hsiao

TSMC: 101 patents #257 of 12,232Top 3%
ME Mediatek: 14 patents #178 of 2,888Top 7%
IT ITRI: 8 patents #738 of 9,619Top 8%
HD Hannstar Display: 2 patents #174 of 451Top 40%
IN Invensas: 2 patents #97 of 142Top 70%
QD Quanta Display: 2 patents #10 of 120Top 9%
WI Wiwynn: 2 patents #34 of 151Top 25%
CO Chi Mei Optoelectronics: 2 patents #69 of 296Top 25%
CT Chunghwa Picture Tubes: 2 patents #298 of 907Top 35%
AO Au Optronics: 2 patents #1,286 of 2,945Top 45%
TA Taiwan Tft Lcd Association: 2 patents #15 of 55Top 30%
TO Toppoly Optoelectronics: 2 patents #30 of 130Top 25%
TL Tsmc Solid State Lighting: 2 patents #44 of 86Top 55%
EP Epistar: 1 patents #519 of 732Top 75%
📍 Hsinchu, CA: #16 of 400 inventorsTop 4%
Overall (All Time): #7,726 of 4,157,543Top 1%
135
Patents All Time

Issued Patents All Time

Showing 126–135 of 135 patents

Patent #TitleCo-InventorsDate
7929564 System, apparatus, and method for loading bits into sub-channels Ta-Sung Lee 2011-04-19
7888236 Semiconductor device and fabrication methods thereof Han-Ping Pu, Bai-Yao Lou, Dean Wang, Kai-Ming Ching, Chen-Cheng Kuo +3 more 2011-02-15
7838333 Electronic device package and method of manufacturing the same Shou-Lung Chen, Yu-Hua Chen, Jeng-Dar Ko, Jyh-Rong Lin 2010-11-23
7632707 Electronic device package and method of manufacturing the same Shou-Lung Chen, Yu-Hua Chen, Jeng-Dar Ko, Jyh-Rong Lin 2009-12-15
7572676 Packaging structure and method of an image sensor module Fang-Jun Leu, Shou-Lung Chen, Shan-Pu Yu, Jyh-Rong Lin, I-Hsuan Peng +3 more 2009-08-11
7554639 Method to control the pretilt angle of liquid crystal device Bang-Hao Wu, Hsin-Chun Chiang, Yu-Ming Chen 2009-06-30
7528009 Wafer-leveled chip packaging structure and method thereof Shou-Lung Chen, Yu-Hua Chen, Jeng-Dar Ko, Chih-Ming Tzeng, Jyh-Rong Lin +1 more 2009-05-05
7411306 Packaging structure and method of an image sensor module Fang-Jun Leu, Shou-Lung Chen, Shan-Pu Yu, Jyh-Rong Lin, I-Hsuan Peng +3 more 2008-08-12
7405788 Method for alignment of liquid crystal molecules by using hydrogen ion beam in an amount greater than one hundred times that of non-hydrogen ions Bang-Hao Wu, Yu-Ming Chen, Hsin-Chun Chiang, Chung-Wen Wu 2008-07-29
7294920 Wafer-leveled chip packaging structure and method thereof Shou-Lung Chen, Yu-Hua Chen, Jeng-Dar Ko, Chih-Ming Tzeng, Jyh-Rong Lin +1 more 2007-11-13